10AX115H4F34E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,066 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115H4F34E3SG – Arria 10 GX FPGA, 1,150,000 logic elements, 1152-FCBGA
The 10AX115H4F34E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-FCBGA package. It is a 20 nm mid-range FPGA family device designed for high-performance, power-sensitive applications across wireless, wireline, broadcast, compute/storage, medical and defense markets.
This device combines high logic capacity, large on-chip RAM, and flexible I/O in a surface-mount 1152-FCBGA (35 × 35 mm) package, offering a platform for complex packet processing, high-speed networking, signal processing, and hardware acceleration tasks while operating within an extended temperature range.
Key Features
- High Logic Capacity — 1,150,000 logic elements to support large, complex designs and high-density logic integration.
- Large On-Chip Memory — 68,857,856 total RAM bits for buffering, packet processing, and data-path state storage.
- Ample I/O — 504 user I/O pins to interface with multiple external devices and memory systems.
- Package and Mounting — 1152-FCBGA (35 × 35 mm) surface-mount package (1152-BBGA / FCBGA) for compact board-level integration.
- Power Supply Range — Core supply range of 870 mV to 930 mV to align with system power designs.
- Extended Temperature Grade — Rated for 0 °C to 100 °C operating temperature for deployment in temperature-challenging environments.
- 20 nm Arria 10 Family Architecture — Device family features emphasize improved performance and power efficiency for mid-range FPGA applications.
- RoHS Compliant — Conforms to RoHS standards for hazardous-substance restrictions.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio heads and mobile backhaul designs that require dense logic and on-chip memory for signal processing.
- High-Speed Wireline Systems — 40G/100G muxponders, transponders and line cards where logic density and memory support complex packet handling and aggregation.
- Broadcast and Media — Studio switches, video processing and professional audio/video systems that benefit from large RAM capacity and flexible I/O.
- Compute and Storage Acceleration — Flash cache, server acceleration and cloud compute offloads that leverage FPGA logic and embedded memory for performance-sensitive workloads.
- Medical and Defense Electronics — Diagnostic imaging and radar/electronic warfare subsystems where high logic capacity and deterministic hardware behavior are required within the specified temperature range.
Unique Advantages
- High integration density: 1,150,000 logic elements reduce the need for multiple devices and lower system BOM complexity.
- Large embedded memory: Nearly 69 million bits of on-chip RAM enable deep buffering and complex state machines without external memory dependence.
- Flexible system I/O: 504 I/O pins support broad interfacing options to external peripherals, memory, and transceiver modules.
- Compact FCBGA package: 1152-FCBGA (35 × 35 mm) supports high-density PCB layouts while keeping the solution board-level friendly.
- Designed for power-sensitive designs: The Arria 10 family’s 20 nm architecture targets improved performance-per-watt for mid-range FPGA use cases.
- Extended temperature operation: Rated 0 °C to 100 °C to suit applications that require wider-than-commercial temperature tolerance.
Why Choose 10AX115H4F34E3SG?
The 10AX115H4F34E3SG positions itself as a high-capacity, mid-range FPGA choice for designs that need substantial logic resources and on-chip memory in a compact FCBGA package. Its combination of 1,150,000 logic elements, 68,857,856 RAM bits, and 504 I/O makes it suitable for demanding signal processing, networking, and compute-acceleration tasks where integration and power efficiency matter.
Engineers targeting scalable mid-range systems will find this Arria 10 GX device appropriate for reducing external components, consolidating functionality, and leveraging the Arria 10 family’s architecture for power-sensitive, performance-oriented applications. RoHS compliance and the extended temperature rating further support deployment across a variety of equipment classes.
Request a quote or submit your project requirements to receive pricing and availability information for the 10AX115H4F34E3SG FPGA.

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