10AX115H3F34I2SGES

The 10AX115H3F34I2SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) provided in a 1152-FCBGA (35×35) surface-mount package. It delivers a high logic capacity and substantial embedded memory in a power-optimized 20 nm device family suited for midrange, performance-sensitive designs.

Targeted at communications, compute, broadcast and industrial applications, this device combines 1,150,000 logic elements, 68,857,856 bits of on-chip RAM and 504 general-purpose I/Os to support complex, high-throughput system architectures while operating across an industrial temperature range.

Key Features

• Core capacity — 1,150,000 logic elements to implement large, complex logic and custom accelerators.
• Embedded memory — 68,857,856 total RAM bits for deep buffering, caching and on-chip working memory.
• I/O and interfaces — 504 general-purpose I/O pins to support a broad range of external interfaces and board-level connectivity.
• Transceivers and protocol hard IP (family-level) — Arria 10 family documentation describes low-power serial transceivers and hard IP for PCIe Gen1/2/3, Interlaken and 10 Gbps Ethernet, enabling high-speed protocol implementation.
• DSP and compute fabric — Variable-precision DSP block architecture and adaptive logic modules in the Arria 10 family support mixed-precision signal processing and arithmetic acceleration.
• Power and supply — Operates with core supply in the 870 mV to 930 mV range, supporting power-optimized designs on the Arria 10 platform.
• Package and mounting — 1152-FCBGA (35×35) surface-mount package for compact board integration and high I/O density.
• Temperature and grade — Industrial grade with an operating range of −40 °C to 100 °C for demanding environments.
• Standards and compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel cards, remote radio heads and mobile backhaul equipment leveraging high logic capacity and embedded memory for signal processing and packet handling.
• Wireline networking — 40G/100G muxponders, transponders and line cards that require high-speed serial interfaces, protocol hard IP and large on-chip buffering.
• Broadcast and professional AV — Studio switches, video transport and conferencing systems benefiting from high I/O count and substantial memory for media processing and routing.
• Compute and storage acceleration — Flash cache, server acceleration and cloud compute applications using the FPGA fabric and DSP resources for latency-sensitive workloads.
• Medical and industrial imaging — Diagnostic imaging and scanning systems that need sustained processing performance within an industrial temperature range.

Unique Advantages

• High logic density: 1,150,000 logic elements enable integration of large custom logic functions and multiple processing engines on a single device, reducing BOM and board complexity.
• Large on-chip memory: 68,857,856 bits of embedded RAM provide substantial local storage for buffering, frame storage and high-bandwidth data paths without external memory for some use cases.
• Rich I/O and protocol support: 504 I/Os combined with Arria 10 family-level support for PCIe, Interlaken and 10 Gbps Ethernet simplify implementation of modern high-speed interfaces.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact, high-density package: 1152-FCBGA (35×35) delivers a balance of I/O count and PCB area efficiency for space-constrained designs.
• Power-optimized operation: Core supply range of 870 mV to 930 mV supports low-power system design and aligns with the Arria 10 family emphasis on power efficiency.

Why Choose 10AX115H3F34I2SGES?

The 10AX115H3F34I2SGES positions itself for system designs that require a combination of high logic capacity, extensive on-chip memory and broad I/O connectivity in an industrial-grade FPGA. Its Arria 10 GX heritage provides family-level capabilities for high-speed serial protocols, DSP acceleration and power-aware operation.

This part is suited for engineers building midrange, performance-sensitive products in communications, compute acceleration, broadcast and industrial imaging where integrating complex logic and memory on a single device reduces system cost and shortens development cycles.

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