10AX115H3F34I2LG

The 10AX115H3F34I2LG is an Intel Arria 10 GX family FPGA implemented in a 1152‑ball FCBGA (35×35) package. It is part of the 20‑nm Arria 10 device family offering mid‑range, high‑performance, power‑efficient FPGA silicon intended for diverse applications.

Arria 10 GX devices target markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems where performance, embedded memory capacity and flexible I/O are important. This device combines high logic density, substantial embedded RAM, and a broad I/O complement for system integration in industrial environments.

Key Features

• Logic Capacity 1,150,000 logic elements, enabling complex programmable logic and integration of large custom functions.
• Embedded Memory 68,857,856 total RAM bits to support on‑chip buffering, caches, and data storage for high‑throughput designs.
• I/O and Package 504 I/O pins in a 1152‑FCBGA (35×35) surface‑mount package to support dense board integration and multiple interface standards.
• Voltage Supply Operates from 870 mV to 930 mV, supporting the device’s core power requirements.
• Thermal and Mounting Industrial grade with an operating temperature range of −40 °C to 100 °C and surface‑mount package suitable for standard PCB assembly.
• Series-Level Silicon Features Arria 10 family features include embedded memory blocks, variable‑precision DSP blocks, low‑power serial transceivers, and PCIe Gen1/Gen2/Gen3 hard IP as described in the Arria 10 device documentation.
• Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment requiring programmable baseband, control and interface logic.
• Wireline and Networking 40G/100G muxponders, transponders, line cards and aggregation modules where high logic density and transceiver capabilities are needed.
• Broadcast and Media Studio switching, video transport and professional audio/video processing that require on‑chip memory and programmable I/O.
• Computing and Storage Flash cache, server acceleration and cloud computing applications that benefit from embedded RAM and DSP resources for data paths.
• Medical and Defense Diagnostic imaging, radar, electronic warfare and secure communications leveraging the device’s performance and industrial temperature range.

Unique Advantages

• High Logic Density: 1,150,000 logic elements provide space to consolidate multiple functions on a single device, reducing system BOM and board complexity.
• Large On‑Chip Memory: Nearly 69 million RAM bits enable large buffers, frame storage and algorithm acceleration without relying solely on external memory.
• Flexible I/O and Integration: 504 I/O pins in a compact 1152‑FCBGA package support multiple interfaces and enable dense system designs.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
• Power‑Optimized Core: Core supply range of 870–930 mV aligns with Arria 10 family power management for efficiency in mid‑range, performance‑sensitive applications.
• Documented Series Capabilities: Arria 10 device documentation describes features such as DSP blocks, embedded memory configurations, PCIe and high‑speed serial transceivers that aid system design and verification.

Why Choose 10AX115H3F34I2LG?

The 10AX115H3F34I2LG Arria 10 GX FPGA positions itself where high logic capacity, substantial on‑chip memory and flexible I/O must coexist in an industrial‑rated package. Its 1152‑ball FCBGA package and 504 I/O pins help integrate multiple subsystems on a single FPGA, while the device’s operating range and RoHS compliance support deployment in regulated and temperature‑variable applications.

This device is suited to engineering teams designing mid‑range systems that require programmable hardware acceleration, large embedded buffering and a compact board footprint, backed by the Arria 10 family documentation for system architects and developers.

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