10AX115H2F34I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 881 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115H2F34I2SGES – Arria 10 GX FPGA, 1152-FCBGA
The 10AX115H2F34I2SGES is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-FCBGA package. It is built on the Arria 10 device family architecture, a 20 nm mid-range FPGA family designed for higher performance and improved power efficiency.
This device targets high-performance, power-sensitive midrange applications across wireless, wireline, broadcast, computing and storage, medical, and military markets by combining large logic capacity, abundant embedded memory, and a broad set of I/O capabilities.
Key Features
- Programmable Logic Capacity — 1,150,000 logic elements provide substantial programmable fabric for complex logic, packet processing, and custom accelerators.
- Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, caching, and data path storage to support memory-intensive designs.
- I/O Density — 504 I/O pins enable dense external connectivity for high-bandwidth interfaces and multiple peripheral connections.
- Transceiver and Interface Capabilities (Series Features) — Arria 10 device family documentation highlights support for high-speed serial transceivers, enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken, and PCIe Gen1/Gen2/Gen3 hard IP options.
- Clocking and PLLs (Series Features) — Fractional synthesis and I/O PLLs are part of the Arria 10 device family feature set to support flexible clocking strategies.
- Package and Mounting — 1152-FCBGA (35×35) package in a surface-mount form factor for board-level integration.
- Power Supply Range — Core voltage range of 870 mV to 980 mV to match platform power budgets.
- Operating Temperature — Rated for −40 °C to 100 °C operation for industrial-temperature deployments.
- RoHS Compliant — Device is compliant with RoHS environmental requirements.
Typical Applications
- Wireless Infrastructure — Packet processing and control logic for channel and switch cards in remote radio heads and mobile backhaul equipment.
- Wireline and Optical Networking — Line cards, muxponders, and transponders that require high-throughput packet handling and protocol offload.
- Broadcast and Professional Video — Video switching, signal processing, and transport functions in studio and transport systems.
- Computing and Storage — Server acceleration, flash cache controllers, and cloud-compute accessory functions that benefit from large on-chip memory and programmable logic.
- Medical and Defense Systems — Imaging, signal processing, radar, and guidance subsystems that require configurable logic and industrial-temperature operation.
Unique Advantages
- High Logic Density: 1,150,000 logic elements enable complex, high-parallelism designs without immediate need for multiple devices.
- Substantial On‑Chip Memory: Nearly 69 Mb of RAM bits reduces dependence on external memory for buffering and accelerates data-path performance.
- Broad I/O Count: 504 I/Os support extensive peripheral and high-speed interface connectivity for multi-protocol designs.
- Series-Level High-Speed IP: Arria 10 family features include PCIe Gen1/2/3 hard IP and enhanced PCS for 10 Gbps Ethernet and Interlaken, helping shorten time-to-market for networking and communications applications.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
- Solderable Surface-Mount Package: 1152-FCBGA (35×35) enables compact board layouts while providing the pin count needed for dense systems.
Why Choose 10AX115H2F34I2SGES?
The 10AX115H2F34I2SGES positions designers to implement high-performance, power-aware midrange systems by combining a large programmable fabric, extensive on-chip memory, and rich I/O resources in a single Arria 10 GX device. Its 20 nm architecture and family-level features for high-speed interfaces make it suitable for communications, video, compute acceleration, and mission-critical embedded applications that require flexibility and scalability.
Choosing this device offers a pathway to consolidate functions into one FPGA, minimize external component count, and leverage Arria 10 family capabilities for designs that must balance performance, power, and integration.
Request a quote or submit an inquiry for pricing and availability of the 10AX115H2F34I2SGES. Our team can provide lead-time and ordering information to support your procurement and design schedule.

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