10AX115H2F34I2SGES

IC FPGA 504 I/O 1152FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA

Quantity 881 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O504Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115H2F34I2SGES – Arria 10 GX FPGA, 1152-FCBGA

The 10AX115H2F34I2SGES is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-FCBGA package. It is built on the Arria 10 device family architecture, a 20 nm mid-range FPGA family designed for higher performance and improved power efficiency.

This device targets high-performance, power-sensitive midrange applications across wireless, wireline, broadcast, computing and storage, medical, and military markets by combining large logic capacity, abundant embedded memory, and a broad set of I/O capabilities.

Key Features

  • Programmable Logic Capacity — 1,150,000 logic elements provide substantial programmable fabric for complex logic, packet processing, and custom accelerators.
  • Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, caching, and data path storage to support memory-intensive designs.
  • I/O Density — 504 I/O pins enable dense external connectivity for high-bandwidth interfaces and multiple peripheral connections.
  • Transceiver and Interface Capabilities (Series Features) — Arria 10 device family documentation highlights support for high-speed serial transceivers, enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken, and PCIe Gen1/Gen2/Gen3 hard IP options.
  • Clocking and PLLs (Series Features) — Fractional synthesis and I/O PLLs are part of the Arria 10 device family feature set to support flexible clocking strategies.
  • Package and Mounting — 1152-FCBGA (35×35) package in a surface-mount form factor for board-level integration.
  • Power Supply Range — Core voltage range of 870 mV to 980 mV to match platform power budgets.
  • Operating Temperature — Rated for −40 °C to 100 °C operation for industrial-temperature deployments.
  • RoHS Compliant — Device is compliant with RoHS environmental requirements.

Typical Applications

  • Wireless Infrastructure — Packet processing and control logic for channel and switch cards in remote radio heads and mobile backhaul equipment.
  • Wireline and Optical Networking — Line cards, muxponders, and transponders that require high-throughput packet handling and protocol offload.
  • Broadcast and Professional Video — Video switching, signal processing, and transport functions in studio and transport systems.
  • Computing and Storage — Server acceleration, flash cache controllers, and cloud-compute accessory functions that benefit from large on-chip memory and programmable logic.
  • Medical and Defense Systems — Imaging, signal processing, radar, and guidance subsystems that require configurable logic and industrial-temperature operation.

Unique Advantages

  • High Logic Density: 1,150,000 logic elements enable complex, high-parallelism designs without immediate need for multiple devices.
  • Substantial On‑Chip Memory: Nearly 69 Mb of RAM bits reduces dependence on external memory for buffering and accelerates data-path performance.
  • Broad I/O Count: 504 I/Os support extensive peripheral and high-speed interface connectivity for multi-protocol designs.
  • Series-Level High-Speed IP: Arria 10 family features include PCIe Gen1/2/3 hard IP and enhanced PCS for 10 Gbps Ethernet and Interlaken, helping shorten time-to-market for networking and communications applications.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Solderable Surface-Mount Package: 1152-FCBGA (35×35) enables compact board layouts while providing the pin count needed for dense systems.

Why Choose 10AX115H2F34I2SGES?

The 10AX115H2F34I2SGES positions designers to implement high-performance, power-aware midrange systems by combining a large programmable fabric, extensive on-chip memory, and rich I/O resources in a single Arria 10 GX device. Its 20 nm architecture and family-level features for high-speed interfaces make it suitable for communications, video, compute acceleration, and mission-critical embedded applications that require flexibility and scalability.

Choosing this device offers a pathway to consolidate functions into one FPGA, minimize external component count, and leverage Arria 10 family capabilities for designs that must balance performance, power, and integration.

Request a quote or submit an inquiry for pricing and availability of the 10AX115H2F34I2SGES. Our team can provide lead-time and ordering information to support your procurement and design schedule.

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