10AX115H3F34E2SG

The 10AX115H3F34E2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1152‑FCBGA surface-mount package. It is a 20 nm mid-range FPGA device family member designed for high-performance, power-efficient applications across communications, broadcast, computing, medical, and defense markets.

This device combines high logic capacity, large embedded memory, and extensive I/O to address complex system-level functions such as packet processing, high-speed I/O interfacing, and compute acceleration while operating within a low voltage supply range.

Key Features

• Logic Capacity — 1,150,000 logic elements suitable for large, complex designs and parallel processing workloads.
• Embedded Memory — 68,857,856 total RAM bits to support on-chip buffering, caching, and data staging for high-throughput applications.
• I/O Resources — 504 I/O pins to enable diverse high-density connectivity and external interface options.
• Package & Mounting — 1152‑FCBGA (35×35) package in a surface-mount form factor for compact board integration.
• Power Supply — Core voltage range of 870 mV to 930 mV for low-voltage operation tailored to the Arria 10 family.
• Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance — RoHS-compliant construction for environmental and manufacturing requirements.
• Arria 10 Device Family Capabilities — As part of the Arria 10 family, the device aligns with the series’ architecture and features for mid-range, power-conscious designs.

Typical Applications

• Wireless Infrastructure — Channel and switch card implementations and mobile backhaul equipment that require high logic density and on-chip memory for packet processing.
• Wireline & Optical Transport — 40G/100G muxponder and transponder functions, line-card processing and aggregation where large logic and I/O counts are needed.
• Broadcast & Media — Studio switching, video transport, and professional audio/video processing leveraging substantial embedded RAM and logic resources.
• Computing & Storage — Flash cache, server acceleration and cloud compute offload tasks that benefit from high logic element counts and on-chip memory.
• Medical & Defense Systems — Diagnostic imaging, radar, and secure communications modules that require extended-grade operation and high integration.

Unique Advantages

• High Logic Density: 1,150,000 logic elements enable large-scale custom logic implementations and parallel datapaths within a single device.
• Large On‑Chip Memory: 68,857,856 RAM bits reduce dependence on external memory for buffering and accelerate data-path operations.
• Extensive I/O: 504 I/O pins provide flexibility for multi-protocol interfaces and high-pin-count system designs.
• Compact, Surface‑Mount Package: 1152‑FCBGA (35×35) delivers a high-pin-count solution in a space-efficient footprint for dense PCB layouts.
• Low Core Voltage: 870 mV–930 mV core supply supports low-voltage design targets typical of modern FPGA deployments.
• Extended Grade Operation: Rated for 0 °C to 100 °C operation, suitable for a range of commercial and rugged applications requiring extended-grade components.

Why Choose 10AX115H3F34E2SG?

The 10AX115H3F34E2SG positions itself as a high-capacity, mid-range FPGA option within the Intel Arria 10 GX family, combining over a million logic elements with extensive embedded RAM and I/O to address demanding data-path and interface-intensive applications. Its low core voltage and extended-grade thermal range make it appropriate for designs that balance performance with power efficiency and reliability.

This part is suited for engineers building communications, compute-acceleration, broadcast, medical, or defense systems that require on-chip scalability and a compact, high-pin-count package. As a member of the Arria 10 family, it integrates characteristics aligned with that device series for projects that need significant programmable logic and memory resources on a single FPGA.

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