10AX115H3F34I2SG

The 10AX115H3F34I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) packaged in a 1152-FCBGA (35×35) surface-mount package. It implements a 20 nm mid-range FPGA architecture designed for high-performance, power-sensitive applications.

With 1,150,000 logic elements, 68,857,856 bits of embedded RAM and 504 I/O, this industrial-grade device supports complex logic integration and broad external interfacing while operating from 870 mV to 930 mV and across an industrial temperature range of −40°C to 100°C.

Key Features

• Core Capacity — 1,150,000 logic elements enabling large-scale, densely integrated logic designs.
• Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, caching and data storage.
• I/O Count — 504 general-purpose I/O pins to support diverse external interfaces and system-level connectivity.
• Power Supply — Supported core voltage range from 870 mV to 930 mV for controlled power delivery and design planning.
• Package & Mounting — 1152-FCBGA (35×35) package, surface-mount configuration for compact, high-density board layouts.
• Operating Temperature & Grade — Industrial grade with operating range −40°C to 100°C for deployment in harsh environments.
• Compliance — RoHS compliant.
• Arria 10 Device Family Features — Device overview documents list family-level capabilities such as clock networks and PLL clock sources, embedded memory blocks, and support for high-speed serial transceivers and PCIe hard IP (refer to Intel Arria 10 device documentation for details).

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment where high logic density and flexible I/O are required.
• Wireline networking — 40G/100G muxponders, transponders and 100G line card designs that need on-chip memory and extensive I/O.
• Broadcast and professional AV — Studio switches, video transport and videoconferencing systems benefiting from large embedded RAM and programmable logic.
• Computing and storage — Flash cache, cloud server acceleration and other data-center applications that require dense logic resources and on-chip memory.
• Medical and defense systems — Diagnostic imaging, radar and secure communications where industrial temperature range and high integration are valuable.

Unique Advantages

• High integration density: 1,150,000 logic elements allow consolidation of large functions onto a single device, reducing board-level complexity.
• Substantial on-chip RAM: 68,857,856 bits of embedded memory support deep buffering and on-device data processing without immediate external memory reliance.
• Flexible system I/O: 504 I/O pins accommodate multiple external interfaces and simplify system partitioning.
• Industrial robustness: −40°C to 100°C operating range and industrial grade designation enable deployment in demanding environments.
• Compact packaging: 1152-FCBGA (35×35) surface-mount package provides a small footprint for space-constrained PCBs.
• Standards and documentation support: The Arria 10 device family is supported by comprehensive Intel device documentation and design resources referenced in the product overview.

Why Choose 10AX115H3F34I2SG?

The 10AX115H3F34I2SG positions itself for mid-range, high-performance and power-aware designs that require large programmable logic capacity, significant on-chip memory and broad external interfacing. Its industrial-grade temperature range and RoHS compliance make it suitable for demanding applications across communications, broadcast, computing, medical and defense markets.

Engineers seeking a compact, highly integrated FPGA solution will find this Arria 10 GX device delivers the core resources and documentation lineage needed to accelerate development and scale system functionality while preserving board area and I/O flexibility.

Request a quote or submit an inquiry for 10AX115H3F34I2SG to evaluate it for your next design.