10AX115H4F34E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 940 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115H4F34E3LG – Arria 10 GX FPGA, 1152-FCBGA (35×35)
The 10AX115H4F34E3LG is an Arria 10 GX field‑programmable gate array (FPGA) offered in a 1152‑ball FCBGA (35×35) package. It is part of the Arria 10 device family of 20 nm mid‑range FPGAs and SoCs designed for high‑performance, power‑sensitive applications.
Designed for applications across wireless, wireline, broadcast, computing and storage, medical and secure communications markets, the device emphasizes performance and power efficiency while providing high logic capacity, large on‑chip memory, and extensive high‑speed I/O resources.
Key Features
- Logic Capacity — 1,150,000 logic elements, providing high programmable logic density for complex designs.
- Embedded Memory — 68,857,856 total RAM bits to support large on‑chip buffering, caches, and data processing pipelines.
- I/O and Package — 504 user I/O pins in a 1152‑FBGA (1152‑FCBGA) 35×35 surface‑mount package for dense board integration.
- Core Voltage — Supported core supply range of 870 mV to 930 mV for defined power domain design.
- Grade and Temperature — Extended grade device with an operating temperature range of 0°C to 100°C.
- High‑speed Interfaces — Arria 10 GX family capabilities include low‑power serial transceivers, Interlaken and 10 Gbps Ethernet support, and PCIe Gen1/Gen2/Gen3 hard IP for networking and high‑bandwidth applications.
- Signal Processing and Clocking — Variable‑precision DSP blocks plus comprehensive clock networks and PLL clock sources to support high‑throughput DSP and timing architectures.
- System Integration — Device family features include SoC hard processor system options and support for dynamic and partial reconfiguration to enable flexible system architectures.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio heads and mobile backhaul equipment leveraging the device's high logic density and transceiver support.
- Wireline Networking — 40G/100G muxponders, transponders and line cards that require high‑speed serial interfaces and on‑chip buffering.
- Computing & Storage — Server acceleration, flash cache and cloud computing elements that benefit from large embedded memory and extensive logic resources.
- Broadcast & Professional AV — Studio switches, transport and videoconferencing hardware using the device's I/O density and high‑speed protocol support.
Unique Advantages
- High Logic Density: 1,150,000 logic elements enable implementation of large, complex designs on a single device, reducing multi‑chip partitioning.
- Substantial On‑Chip Memory: Nearly 69Mbits of embedded RAM supports wide data paths, large FIFOs and high‑performance buffering without external memory.
- Broad High‑Speed I/O: 504 I/O pins combined with Arria 10 transceiver and protocol support simplify integration into high‑bandwidth systems.
- Compact, Surface‑Mount Packaging: 1152‑ball FCBGA (35×35) provides a compact, high‑density footprint for space‑constrained PCBs.
- Power‑Aware 20 nm Architecture: Family‑level power‑saving technologies deliver improved performance per watt for power‑sensitive deployments.
- Extended Grade Thermal Range: Rated for 0°C to 100°C operation to match many commercial and industrial embedded system environments.
Why Choose 10AX115H4F34E3LG?
The 10AX115H4F34E3LG Arria 10 GX FPGA combines large programmable logic and memory resources with extensive I/O and high‑speed interface capabilities in a compact FCBGA package. It targets designers who need a mid‑range, performance‑oriented FPGA platform that balances compute density and power efficiency.
As part of the Arria 10 family, this device is suited for midrange systems requiring scalable logic, robust on‑chip memory, and advanced interface support—delivering a platform that can simplify system partitioning and accelerate development for networking, communications, compute acceleration and broadcast applications.
Request a quote or submit an inquiry for pricing and availability to evaluate the 10AX115H4F34E3LG for your next design.

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