10AX115H4F34I3SGE2
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 330 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115H4F34I3SGE2 – Arria 10 GX FPGA, 1152‑FBGA
The 10AX115H4F34I3SGE2 is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑FBGA package designed for mid‑range, performance‑sensitive applications. It delivers high logic density, substantial on‑chip memory, and broad I/O capability for systems that require flexible hardware acceleration and advanced protocol support at the device-family level.
Targeted markets include wireless and wireline infrastructure, compute and storage acceleration, broadcast, medical imaging and defense systems where a combination of compute throughput, power efficiency, and industrial temperature capability is required.
Key Features
- Core Logic 1,150,000 logic elements provide high-density programmable logic suitable for large FPGA designs and hardware acceleration tasks.
- Embedded Memory 68,857,856 total RAM bits for buffering, on-chip data storage and complex state machines.
- I/O and Package 504 I/O pins in a 1152‑FBGA (35×35 mm) supplier device package; surface-mount packaging for compact board designs.
- Voltage and Thermal Core voltage supply range 870 mV to 930 mV and operating temperature range −40 °C to 100 °C, supporting industrial‑grade deployments.
- Series-Level IP and Interfaces Arria 10 device family features referenced in the device overview include PCIe Gen1/Gen2/Gen3 hard IP, support for 10 Gbps Ethernet and Interlaken, fractional synthesis and I/O PLLs, and low‑power serial transceivers.
- Advanced Architecture Elements Device-family capabilities include variable‑precision DSP blocks, adaptive logic modules, and multiple embedded memory types to support signal processing, networking and compute workloads.
- Reconfiguration and System Features The Arria 10 family documentation highlights support for dynamic and partial reconfiguration along with power management and incremental compilation workflows at the series level.
Typical Applications
- Wireless infrastructure Channel and switch cards, remote radio head functions and mobile backhaul implementations that need programmable baseband and interface logic.
- Wireline networking 40G/100G muxponders, transponders and line cards that require high-speed serial interfaces and protocol hard IP.
- Compute and storage acceleration Server acceleration, flash cache and cloud compute offload where on-chip memory and large logic capacity enable custom data paths and accelerators.
- Broadcast and media Studio switches and transport solutions that benefit from programmable routing, packet processing and high‑speed I/O.
- Medical and defense systems Diagnostic imaging, radar and electronic warfare systems leveraging high logic density, DSP capability and industrial temperature range.
Unique Advantages
- High logic density: 1,150,000 logic elements enable complex designs and multiple concurrent accelerators on a single device, reducing system BOM.
- Large on‑chip memory: 68,857,856 RAM bits support deep buffering, state retention and high‑throughput data paths without relying solely on external memory.
- Broad I/O: 504 I/O pins in a compact 1152‑FBGA package simplify board routing while providing flexible external interface options.
- Industrial temperature range: −40 °C to 100 °C supports deployments in harsher environments and extended operating conditions.
- Series-level connectivity and IP: Integrated Arria 10 family capabilities such as PCIe hard IP, 10 Gbps Ethernet support and low‑power transceivers reduce development time for networking and transport designs.
- Surface-mount packaging: 1152‑FCBGA (35×35) surface-mount form factor enables dense board layouts and standardized assembly processes.
Why Choose 10AX115H4F34I3SGE2?
The 10AX115H4F34I3SGE2 positions itself as a high‑density, mid‑range FPGA solution within the Intel Arria 10 GX family, combining substantial logic capacity, large embedded memory and extensive I/O to address demanding applications in communications, compute acceleration and industrial systems. Its industrial temperature range and surface‑mount 1152‑FBGA packaging make it suitable for production deployments that require robustness and compact board integration.
Backed by the Arria 10 device family documentation and device‑level features, this part is appropriate for teams designing programmable accelerators, protocol engines and high‑bandwidth data paths who need verifiable on‑chip resources and series‑level hard IP support.
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