10AX115N2F40E2SG

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA

Quantity 1,146 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N2F40E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX115N2F40E2SG is an Intel Arria 10 GX-series FPGA device designed for midrange, performance-sensitive applications. Based on the Arria 10 device family architecture, it delivers a high-density, power-conscious programmable fabric optimized for system integration in communications, broadcast, compute and specialized imaging markets.

This device combines a large logic fabric, substantial embedded RAM, and extensive I/O in a 1517-FCBGA package, making it suitable for designs that require dense programmable logic, on-chip memory, and broad external connectivity while operating within defined voltage and temperature windows.

Key Features

  • High Logic Density — 1,150,000 logic elements provide substantial programmable capacity for complex digital functions and large-scale logic integration.
  • Embedded Memory — 68,857,856 total RAM bits support large on-chip buffering, state storage, and algorithmic working memory.
  • Extensive I/O — 600 device I/Os enable wide external interfacing for high-pin-count systems and rich peripheral connectivity.
  • Package and Mounting — Supplied in a 1517-FCBGA (1517-BBGA) 40×40 package for surface-mount assembly and compact board-level integration.
  • Power Supply Range — Core voltage support from 870 mV to 980 mV, suitable for the device’s specified power architecture.
  • Operating Range & Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C for controlled-environment applications.
  • RoHS Compliant — Conforms to RoHS directives for lead-free assembly and environmental compliance.
  • Arria 10 Family Attributes — Part of the 20 nm Arria 10 device family described as mid-range FPGAs and SoCs with power-efficiency and higher performance characteristics in its class.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and moderate power efficiency are required.
  • Wireline Communications — 40G/100G muxponders, transponders, and line cards that benefit from high logic density and abundant I/O for packet processing and data-plane functions.
  • Broadcast and Professional AV — Studio switches, transport, and videoconferencing systems requiring flexible, high-capacity logic and on-chip memory for real-time media processing.
  • Compute and Storage Acceleration — Flash cache, server acceleration, and cloud compute offloads that leverage large programmable fabrics and embedded RAM for custom acceleration tasks.
  • Medical and Defense Electronics — Diagnostic imaging and radar/control subsystems that require scalable logic resources and deterministic hardware implementation.

Unique Advantages

  • Substantial Logic Resources: 1,150,000 logic elements enable integration of complex data paths, custom accelerators, and protocol engines on a single device, reducing board-level component count.
  • Large On‑Chip Memory: Nearly 69 million RAM bits provide ample on-chip storage for buffering, lookup tables, and intermediate data, improving throughput and latency for memory-intensive algorithms.
  • High I/O Count: 600 I/Os support wide external interfacing options for high-density system designs, simplifying routing of multiple peripherals and buses.
  • Compact FCBGA Packaging: The 1517-FCBGA (40×40) package delivers a high pin-count footprint in a single, surface-mount module suitable for space-constrained PCBs.
  • Arria 10 Family Benefits: Built on the Arria 10 20 nm device family, the device inherits the series focus on performance and power-efficiency for midrange FPGA and SoC applications.
  • Environment & Compliance: Extended-grade temperature operation (0 °C to 100 °C) and RoHS compliance support deployment in controlled-environment commercial and industrial designs.

Why Choose 10AX115N2F40E2SG?

The 10AX115N2F40E2SG positions itself as a high-capacity, midrange Arria 10 GX FPGA for designs that need large programmable logic, significant on-chip memory, and wide external connectivity in a compact surface-mount package. Its core voltage window and extended-grade operating temperature make it suitable for controlled-environment communications, broadcast, compute acceleration, and imaging systems.

For engineering teams seeking a programmable platform with measurable logic and memory resources, high I/O density, and the ecosystem association of the Arria 10 family, this device offers a balanced combination of integration and scalability for medium-to-large FPGA designs.

Request a quote or submit your requirements to receive pricing and availability for the 10AX115N2F40E2SG FPGA.

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