10AX115N2F40I2SGE2

The 10AX115N2F40I2SGE2 is an Intel Arria 10 GX field‑programmable gate array (FPGA) device built on a 20‑nm architecture. It delivers a high logic element count, substantial embedded RAM, and extensive I/O in a 1517‑ball FCBGA package targeted at mid‑range, high‑performance and power‑sensitive applications.

Typical market segments documented for the Arria 10 family include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense applications where performance, integration, and power efficiency are required.

Key Features

• Core density — 1,150,000 logic elements enabling complex digital designs and high levels of integration.
• Embedded memory — 68,857,856 total RAM bits for on‑chip buffering, caching, and fast local storage.
• I/O capacity — 600 I/O pins to support broad connectivity and multiple external interfaces.
• Package & mounting — 1517‑FCBGA (1517‑BBGA) supplier package, 40×40 ball array, surface‑mount for compact board integration.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployments in demanding environments.
• Core voltage range — 870 mV to 980 mV supply range to align with core power requirements.
• Transceivers and IP — Device family documentation highlights low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken support, and variable‑precision DSP blocks.
• System features — Clock networks with PLLs, dynamic and partial reconfiguration capabilities, and embedded memory block configurations described in family documentation.
• Compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul leveraging high logic density and serial transceiver features.
• Wireline networking — 40G/100G muxponders, transponders and line cards that benefit from embedded memory and PCIe/PCS hard IP.
• Broadcast and media — Studio switches, professional audio/video processing, and videoconferencing equipment using on‑chip DSP and memory resources.
• Computing and storage acceleration — Flash cache, server acceleration and cloud computing applications that require large logic capacity and dense I/O.

Unique Advantages

• High integration density: 1.15 million logic elements reduce the need for multiple devices and lower system BOM complexity.
• Substantial on‑chip memory: Nearly 69 Mb of embedded RAM supports large buffering and high‑throughput data paths without relying solely on external memory.
• Broad I/O and protocol IP: 600 I/O pins combined with family hard IP for PCIe and high‑speed serial links simplify system interface design.
• Industrial temperature operation: −40 °C to 100 °C rating enables deployment in harsh and temperature‑sensitive environments.
• Power‑aware architecture: Documented family power‑efficiency features and a core supply window of 870–980 mV support power‑sensitive designs.
• Documented ecosystem support: Intel Arria 10 device documentation and handbooks provide design guidance and technical references for implementation.

Why Choose 10AX115N2F40I2SGE2?

The 10AX115N2F40I2SGE2 Arria 10 GX FPGA positions itself for mid‑range designs requiring a combination of high logic capacity, abundant embedded memory, extensive I/O, and industrial temperature operation. Its 1517‑FCBGA surface‑mount package offers a compact footprint for board‑level integration while providing the resources necessary for complex signal processing, networking, and compute‑acceleration tasks.

For engineers and system designers targeting wireless, wireline, broadcast, storage, or imaging applications, this device provides a scalable, documented platform with on‑chip features and hard IP that help reduce external components and accelerate time to market.

Request a quote or submit an inquiry to our sales team to learn more about availability, pricing, and integration support for the 10AX115N2F40I2SGE2.