10AX115N2F45E2SG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,448 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N2F45E2SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1932-FCBGA

The 10AX115N2F45E2SG is an Intel Arria 10 GX series Field Programmable Gate Array supplied in a 1932-FCBGA (45×45) surface-mount package. As a member of the Arria 10 device family, it leverages the family’s 20 nm mid-range FPGA architecture to deliver a balance of high logic capacity and power efficiency for complex, midrange applications.

With 1,150,000 logic elements, 68,857,856 total RAM bits and 768 user I/Os, this device targets communications, compute, broadcast and imaging applications that require large on-chip logic and memory resources combined with high I/O density.

Key Features

  • Core Logic — 1,150,000 logic elements provide a large programmable fabric for complex logic, control and datapath implementations.
  • Embedded Memory — 68,857,856 total RAM bits support extensive on-chip buffering, caching and state storage to minimize external memory dependence.
  • I/O and Package — 768 user I/Os in a 1932-FCBGA (45×45) package; surface-mount mounting simplifies board-level integration while delivering a high pin count.
  • Power Supply & Efficiency — Device supply range 870 mV to 980 mV; Arria 10 family documentation highlights power-efficiency features and power management capabilities.
  • Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C for applications requiring broader-than-commercial thermal tolerance.
  • Advanced On‑Chip Resources — Family-level features include variable-precision DSP blocks, flexible clock networks and PLL clock sources for high-performance signal processing and timing control.
  • High-Speed Interfaces and SoC Options — Arria 10 family documentation describes low‑power serial transceivers, PCIe hard IP and SoC integration capabilities (Hard Processor System) for advanced I/O and subsystem integration.
  • Standards Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel cards, remote radio head designs and mobile backhaul systems that require dense logic and high I/O connectivity.
  • Wireline and Optical Networking — Line cards, muxponders and transponders for 40G/100G systems where on-chip buffering and high-speed interfaces are needed.
  • Broadcast and Professional AV — Studio switches, video transport and conferencing equipment benefiting from integrated logic, memory and high I/O counts.
  • Compute and Storage Acceleration — Flash cache, server acceleration and cloud compute functions that leverage large logic and embedded memory.
  • Medical and Imaging — Diagnostic imaging and scanner subsystems that require on-chip processing, memory and deterministic I/O.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements enable implementation of large, complex designs on a single device to reduce system-level part counts.
  • Large on-chip memory: 68,857,856 total RAM bits provide substantial internal storage for buffers, frame memory and algorithm state, reducing external memory bandwidth requirements.
  • High I/O density: 768 user I/Os support dense connectivity to peripherals, memory devices and high-speed interfaces without sacrificing board layout flexibility.
  • Compact, high-pin-count package: 1932-FCBGA (45×45) packaging delivers a high pin count in a compact footprint for space-constrained systems.
  • Energy-aware operation: 870 mV to 980 mV supply range and family-level power-saving technologies help manage system power in constrained environments.
  • Extended operating range: Extended grade rating and 0 °C to 100 °C operating temperature accommodate broader thermal conditions than typical commercial-only devices.

Why Choose 10AX115N2F45E2SG?

The 10AX115N2F45E2SG positions itself as a high-capacity, midrange FPGA solution for applications that demand extensive logic, abundant embedded memory and high I/O counts in a single package. Its Arria 10 family architecture combines performance-oriented resources such as variable-precision DSP blocks and flexible clocking with documented power-efficiency features and high-speed interface options.

This device is suited for designers building communication systems, broadcast equipment, compute accelerators and imaging systems who need scalable on-chip resources and a compact, high-pin-count package. Supportive device documentation and family-level resources can help accelerate hardware and software development and long-term deployment planning.

Request a quote or submit your configuration and volume requirements to receive pricing and availability information for the 10AX115N2F45E2SG.

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