10AX115N2F45I2SGE2

IC FPGA 768 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 762 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N2F45I2SGE2 – Arria 10 GX FPGA, 1,150,000 Logic Element Cells

The Intel Arria 10 GX 10AX115N2F45I2SGE2 is a high-performance 20 nm mid-range FPGA optimized for power-sensitive, performance-driven applications. As part of the Arria 10 family, this device delivers a balance of logic capacity, embedded memory, and high-density I/O in a compact FCBGA package for demanding communications, compute, and defense markets.

Designed for systems that require large programmable logic arrays, extensive on-chip memory and significant I/O, this industrial-grade FPGA targets wireless and wireline infrastructure, broadcast and professional AV, server acceleration, and mission-critical applications that benefit from Intel's Arria 10 architecture.

Key Features

  • Logic Capacity — 1,150,000 logic element cells and 427,200 logic elements provide extensive programmable fabric for large designs and complex datapaths.
  • Embedded Memory — 68,857,856 total RAM bits of on-chip memory to support buffers, caches, and state storage without external RAM for many functions.
  • I/O Density — 768 user I/O pins enable high channel counts and rich peripheral connectivity in applications requiring extensive external interfaces.
  • Transceiver & Interface Support — Arria 10 GX family features low-power serial transceivers and hardened protocol IP as described for the device family, enabling high-speed serial links and protocol support in system designs.
  • Power & Voltage — Operates from a core supply range of 870 mV to 980 mV, consistent with low-voltage, power-aware system architectures.
  • Package & Mounting — 1932-FCBGA (45 × 45 mm) package in a surface-mount form factor for dense PCB mounting and thermal management.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial and other temperature-demanding environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and high-speed serial links.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards for high-density optical and packet aggregation systems.
  • Broadcast & Professional AV — Studio switches, videoconferencing and professional video equipment benefiting from large on-chip memory and flexible I/O.
  • Computing & Storage — Server acceleration, flash cache and cloud computing support where dense logic and embedded RAM accelerate data-paths and offload processing.
  • Defense & Secure Communications — Radar, electronic warfare, missile guidance and secure communications applications that require rugged operation and high integration.

Unique Advantages

  • Substantial Programmable Fabric: 1,150,000 logic element cells and 427,200 logic elements enable large-scale RTL implementations and complex algorithm mapping.
  • Large On-Chip Memory: Nearly 69 Mb of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • High I/O Count: 768 I/O pins support high channel densities and multiple parallel interfaces, simplifying board-level design for multi-port systems.
  • Industrial Operating Range: −40 °C to 100 °C rating allows deployment in temperature-challenging installations common in telecom and defense.
  • Compact FCBGA Packaging: 1932-FCBGA (45 × 45 mm) provides a high-pin-count package for dense system integration while supporting surface-mount assembly.
  • Power-Aware Core Supply: Operates at a low core voltage range (870 mV–980 mV), aligning with low-power design strategies for energy-sensitive applications.

Why Choose 10AX115N2F45I2SGE2?

The 10AX115N2F45I2SGE2 Arria 10 GX FPGA combines substantial logic resources, extensive embedded memory and high I/O density in a robust industrial-rated FCBGA package. It is positioned for engineers designing mid-range systems where performance, integration and power efficiency must be balanced—such as networking line cards, wireless front-end modules, server acceleration, and defense electronics.

With the Arria 10 device family architecture and the specific device-level attributes provided, this FPGA offers a scalable platform for long-lived designs that require programmable flexibility, significant on-chip resources, and operating range suitable for industrial deployments.

Request a quote or submit an inquiry to get pricing and availability information for the 10AX115N2F45I2SGE2 Arria 10 GX FPGA.

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