10AX115N3F40E2LG

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA

Quantity 757 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N3F40E2LG – Arria 10 GX FPGA, 1517-FCBGA, Extended Grade

The 10AX115N3F40E2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC designed for mid-range, high-performance and power-sensitive applications. It combines a large programmable fabric with embedded memory and advanced I/O capabilities to support demanding networking, compute, broadcast and instrumentation designs.

Built for applications that require significant logic capacity, high on-chip memory, and broad interfacing options, this device delivers the integration and efficiency needed for channel cards, line cards, server acceleration, professional audio/video and diagnostic systems.

Key Features

  • Core logic — 1,150,000 logic elements provide a large programmable fabric for complex logic, control and signal-processing functions.
  • Embedded memory — 68,857,856 total RAM bits enable extensive on-chip buffering, caches and state storage for data-path and control applications.
  • I/O capacity & interfaces — 600 I/O pins support dense external device connectivity; device-level documentation references hard IP options such as PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet.
  • Transceivers and DSP — Family features include low-power serial transceivers and variable-precision DSP blocks for high-throughput serial links and arithmetic-intensive tasks.
  • Clocking and configuration — Dedicated clock networks with PLL clock sources and support for fractional synthesis, plus device support for dynamic and partial reconfiguration.
  • Power and supply — Operates from a supply voltage range of 870 mV to 930 mV and incorporates device-level power management capabilities.
  • Package & mounting — Supplied in a 1517-FCBGA (40×40) package, surface-mount format for high-density board integration.
  • Operating grade — Extended grade with an operating temperature range of 0 °C to 100 °C.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device’s logic density and high-speed serial capabilities.
  • Wireline networking — 40G/100G muxponders, transponders and 100G line cards using the FPGA’s embedded memory and high I/O count for packet processing and buffering.
  • Broadcast and professional AV — Studio switches and video processing systems that require deterministic logic, large on-chip memory and flexible I/O.
  • Computing and storage — Flash cache, server acceleration and cloud computing acceleration where on-chip RAM and DSP resources reduce external memory traffic and latency.
  • Medical and diagnostic equipment — Diagnostic imaging and scanner subsystems that need high logic throughput and configurable processing pipelines.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements provide the scale to implement complex multi-function systems on a single device, reducing external logic.
  • Large on-chip memory: 68,857,856 RAM bits enable significant local buffering and caching to improve data throughput and system responsiveness.
  • Extensive I/O: 600 I/Os simplify board-level routing for multi-channel interfaces and dense connector ecosystems.
  • Advanced interface hard IP: Built-in support for PCIe Gen1–Gen3 and enhanced PCS for Interlaken/10 Gbps Ethernet accelerates time-to-market for high-speed networking products.
  • Compact, manufacturable package: 1517-FCBGA (40×40) surface-mount package supports high-density board designs while maintaining thermal and signal integrity characteristics suitable for extended-grade operation.
  • Extended-grade operation: Rated for 0 °C to 100 °C to meet a broad range of commercial and industrial-adjacent deployment environments.

Why Choose 10AX115N3F40E2LG?

The 10AX115N3F40E2LG positions itself as a scalable, high-capacity FPGA for mid-range systems that demand a balance of performance and power efficiency. With extensive logic resources, large embedded memory, broad I/O and documented support for high-speed interface hard IP, it is well suited to designers building networking, compute acceleration, broadcast and diagnostic equipment.

Backed by Intel’s device documentation and ecosystem resources, the device supports iterative development workflows including dynamic and partial reconfiguration, helping teams optimize performance and power over the product lifecycle.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for part 10AX115N3F40E2LG.

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