10AX115N2F45I2LG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 320 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N2F45I2LG – Arria 10 GX FPGA, 1,150,000 logic elements, 768 I/O

The 10AX115N2F45I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) IC built on the 20 nm device family. It delivers a high-density, industrial-grade FPGA fabric with integrated memory and advanced I/O suitable for midrange, power-sensitive applications across wireless, wireline, broadcast, computing and storage, medical, and military markets.

Key Features

  • High logic density — 1,150,000 logic elements to implement large, complex designs on a single device.
  • Large on‑chip memory — 68,857,856 total RAM bits provided by embedded memory blocks for buffering, caching, and packet processing.
  • Rich I/O connectivity — 768 general purpose I/O pins to support wide external interfacing and parallel buses.
  • Advanced DSP resources — Variable-precision DSP blocks for arithmetic-intensive functions and signal processing (as described for the Arria 10 family).
  • High-speed interface support — Family-level features include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
  • Clocking and timing — Comprehensive clock networks with PLL clock sources and fractional synthesis for flexible clock generation across the design.
  • Dynamic configuration — Support for dynamic and partial reconfiguration to enable in-field updates and resource re-use (Arria 10 family capability).
  • Power and supply — Operates from a core voltage supply range of 870 mV to 980 mV, enabling low-voltage operation.
  • Package and mounting — 1932-FCBGA (45×45) package, surface-mount mounting for compact board-level integration.
  • Industrial grade and temperature range — Rated for industrial operation from −40 °C to 100 °C.
  • RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment requiring high-density logic and low-power operation.
  • Wireline networking — 40G/100G muxponders, transponders and 100G line cards leveraging high-speed serial interfaces and embedded memory for packet buffering and protocol offload.
  • Broadcast and professional AV — Studio switches and transport systems that need high I/O counts and flexible signal processing resources.
  • Computing and storage acceleration — Flash cache and server acceleration tasks that benefit from large on-chip RAM and dense logic for custom data-paths.
  • Medical and defense systems — Diagnostic imaging and radar/electronic-warfare subsystems that require industrial temperature operation and reconfigurable processing.

Unique Advantages

  • High integration in a single device: 1,150,000 logic elements and 68,857,856 bits of embedded RAM reduce system BOM and simplify multi-FPGA partitioning.
  • Broad high-speed interface support: Built-in hard IP for PCIe Gen1/2/3 and enhanced PCS for Interlaken and 10 Gbps Ethernet provides proven protocol blocks and reduces design time.
  • Flexible performance/power tradeoffs: 20 nm Arria 10 family architecture and low core voltage range (870–980 mV) enable power-sensitive designs without sacrificing density.
  • Designed for in-field adaptability: Dynamic and partial reconfiguration (family feature) lets you update or repurpose regions of the device without full reprogramming.
  • Industrial robustness: Rated for −40 °C to 100 °C operation to support demanding environmental requirements.
  • Compact board footprint: 1932-FCBGA (45×45) package provides a high I/O and logic count in a single surface-mount package for space-constrained systems.

Why Choose 10AX115N2F45I2LG?

The 10AX115N2F45I2LG positions complex midrange FPGA requirements into a single, industrial-grade Arria 10 GX device. With over a million logic elements, large embedded RAM, extensive I/O and family-level support for high-speed interfaces and DSP processing, it is suited for customers designing high-performance, power-sensitive systems that need reconfigurability and compact packaging.

Designers targeting wireless and wireline infrastructure, broadcast/video processing, computing acceleration, medical imaging, or defense applications will find the device’s blend of density, memory, interface IP, and industrial temperature rating useful for building scalable, long-lived solutions.

Request a quote or submit an inquiry today to check pricing and availability for the 10AX115N2F45I2LG.

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