10AX115N2F45I1SG

The 10AX115N2F45I1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a high-density 1932-FCBGA package. It delivers a large fabric and embedded memory capacity suitable for mid-range, performance-sensitive applications across wireless, wireline, broadcast, computing, storage, medical, and defense markets.

Built for systems that require high integration, deterministic I/O counts and industrial temperature operation, this device balances logic density, on-chip RAM and I/O resources for complex, high-throughput designs.

Key Features

• Logic Capacity — 1,150,000 logic elements to implement large-scale digital functions and complex custom processing pipelines.
• Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, working memory and high-bandwidth data paths.
• I/O Density — 768 user I/O pins to support dense external interfaces and multiple parallel peripherals.
• Package & Mounting — 1932-FCBGA (45×45) package in a surface-mount form factor for high pin-count, board-level integration.
• Power Supply — Core voltage range 870 mV to 980 mV, enabling designs targeted around the device’s specified supply window.
• Thermal & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Standards & Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic and memory capacity.
• Wireline networking — 40G/100G muxponders, transponders and line cards that require high-density I/O and on-chip buffering.
• Broadcast and professional AV — Studio switches, transport and videoconferencing systems that need configurable signal processing and deterministic I/O.
• Computing and storage acceleration — Flash cache, cloud compute servers and server acceleration functions that benefit from programmable data-paths and embedded RAM.
• Medical and defense systems — Diagnostic imaging, radar and secure communications where industrial temperature range and integration are required.

Unique Advantages

• High logic density: 1,150,000 logic elements enable consolidation of multiple functions and large custom accelerators on a single device, reducing BOM and board complexity.
• Substantial on-chip memory: 68,857,856 RAM bits provide significant local buffering capacity, lowering latency and external memory dependence for many designs.
• Extensive I/O capability: 768 I/O pins support parallel interfaces and high channel counts without additional bridge logic.
• Industrial thermal range: Rated −40 °C to 100 °C to meet temperature demands for industrial and ruggedized system deployments.
• High-pin-count package: 1932-FCBGA (45×45) enables dense routing and high interconnectivity for complex board-level designs.
• RoHS compliant: Facilitates lead-free manufacturing and helps meet environmental compliance requirements.

Why Choose 10AX115N2F45I1SG?

The 10AX115N2F45I1SG positions itself as a high-capacity Arria 10 GX FPGA option for engineers who need a combination of large logic resources, abundant embedded RAM and high I/O density in an industrial-grade package. Its specified core voltage window and broad operating temperature make it suitable for demanding mid-range applications that require reliable, programmable hardware acceleration and flexible I/O integration.

For teams designing wireless infrastructure, high-speed networking, broadcast processing, compute/storage accelerators or medical and defense systems, this device offers a strong platform to scale functionality while keeping system-level complexity and component count under control.

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