10AX115N2F45I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 241 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 768 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N2F45I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements, 1932-FCBGA
The Intel Arria 10 GX Field Programmable Gate Array (FPGA) 10AX115N2F45I2SGES is a high-capacity, industrial-grade FPGA built on the Arria 10 device family. It provides a large logic fabric and substantial on-chip memory to implement complex, performance-sensitive midrange digital designs.
As part of the Arria 10 family, this device leverages 20 nm device technology to deliver improved performance and power efficiency for applications across wireless, wireline, broadcast, computing and storage, and other markets that require dense logic, extensive RAM, and high I/O count.
Key Features
- Logic Capacity Approximately 1,150,000 logic elements, enabling implementation of large-scale digital designs and complex algorithms.
- Embedded Memory 68,857,856 total RAM bits on-chip to support large buffers, caches, and algorithm state storage without external memory for many use cases.
- I/O Density Up to 768 I/O pins, providing the interface capacity required for high-bandwidth peripheral connections and multi-channel systems.
- Package & Mounting Supplied in a 1932-FCBGA (45×45) package (1932-BBGA footprint), designed for surface-mount PCB assembly to support dense board layouts.
- Power Supply Operates from core voltages in the 870 mV to 980 mV range, suitable for modern low-voltage FPGA power architectures.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
- RoHS Compliance RoHS-compliant construction for regulatory and environmental considerations.
- Arria 10 Family Capabilities Built on the Arria 10 platform, which targets higher performance and power efficiency for midrange FPGA applications (20 nm technology).
Typical Applications
- Wireless infrastructure Baseband processing, channel cards, and remote radio head functions that require extensive logic and on-chip memory for signal processing algorithms.
- Wireline systems High-speed line cards, muxponders and transponder designs that need dense logic and a high I/O count to support multiple data channels and protocol handling.
- Computing & storage Server acceleration, flash cache, and FPGA-based offload tasks where large logic capacity and embedded RAM accelerate compute and data-path workloads.
- Broadcast and professional AV Video processing, switch fabric, and transport functions that benefit from the device’s logic density and memory resources.
Unique Advantages
- High integration density: With roughly 1,150,000 logic elements, the device enables consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
- Substantial on-chip memory: 68,857,856 RAM bits provide the headroom for large buffers, frame stores, and algorithm state without immediate dependence on external memory.
- Large I/O complement: 768 I/O pins accommodate multiple high-bandwidth interfaces, simplifying board routing for multi-channel systems.
- Industrial-grade robustness: Rated for −40 °C to 100 °C operation, enabling deployment in temperature-challenging industrial and field environments.
- Compact, high-density package: The 1932-FCBGA (45×45) package supports high pin counts in a compact form factor for space-constrained PCBs.
- Energy-conscious core voltages: Operates in a low-voltage core supply window (870 mV–980 mV), supporting modern power architectures and efficiency strategies.
Why Choose 10AX115N2F45I2SGES?
The 10AX115N2F45I2SGES Arria 10 GX FPGA combines high logic capacity, extensive on-chip memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. It is positioned for midrange designs that demand substantial programmable resources and robust operation across a wide temperature range.
This device is suited to engineers and system designers who need scalable logic and memory resources on a single device while maintaining power-efficient operation enabled by the Arria 10 family. Its package density and industrial rating make it practical for demanding communications, computing, and professional AV products where integration and long-term reliability are priorities.
Request a quote or submit a quote today to receive pricing and lead-time information for the 10AX115N2F45I2SGES Arria 10 GX FPGA.

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