10AX115N3F40I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,755 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N3F40I2SG – Arria 10 GX FPGA, 1,150,000 logic elements
The 10AX115N3F40I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) device in a 1517-FCBGA (40×40) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs focused on delivering higher performance and improved power efficiency for demanding midrange applications.
Targeted markets include wireless, wireline, broadcast, computing and storage, and medical and defense applications where a combination of high logic density, large embedded memory, and extensive I/O is required. The device pairs high logic capacity and on-chip RAM with family-level features for high-speed connectivity and flexible system integration.
Key Features
- Device family and architecture — Part of the Intel Arria 10 20 nm mid-range FPGA family, engineered for performance and power efficiency across midrange designs.
- Logic capacity — 1,150,000 logic elements to implement complex digital logic and custom accelerators.
- Embedded memory — 68,857,856 total RAM bits for on-chip data storage and buffering to reduce external memory dependence.
- I/O and interfaces — 600 general-purpose I/O pins; family documentation references support for PCIe Gen1/Gen2/Gen3 hard IP, Interlaken and 10 Gbps Ethernet features, and low-power serial transceivers.
- Package and mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package suitable for compact board designs.
- Power — Core voltage supply range 870 mV to 930 mV, supporting low-voltage operation consistent with the family’s power-efficiency objectives.
- Temperature and grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
- System and configuration features — Family-level features documented include dynamic and partial reconfiguration, clock networks with PLL clock sources, SEU error detection and correction, and power management capabilities.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require significant logic and on-chip memory for real-time signal processing.
- Wireline networking — 40G/100G muxponders, transponders and line-card designs where high-density logic, embedded memory and high-speed interface IP are needed.
- Computing and storage — Flash cache, cloud server acceleration and storage controllers leveraging large on-chip RAM and programmable logic for custom data paths.
- Broadcast and professional media — Studio switches, transport and videoconferencing equipment that benefit from dense logic, flexible I/O and support for high-speed serial interfaces.
Unique Advantages
- High logic density: 1,150,000 logic elements enable implementation of large, complex FPGA designs and custom hardware accelerators on a single device.
- Significant on-chip memory: 68,857,856 total RAM bits reduce the need for external memory and improve data locality for performance-sensitive applications.
- Extensive I/O and integration: 600 I/O pins and a compact 1517-FCBGA package simplify board-level integration for high-channel-count designs.
- Industrial-grade operation: Specified for −40 °C to 100 °C operation, suitable for industrial environments that require wider temperature tolerance.
- Power-optimized core supply: Low core voltage range (870–930 mV) supports power-efficient implementations consistent with the family’s power-management features.
- Family-level connectivity and system IP: Documentation for the Arria 10 family includes PCIe hard IP, 10 Gbps Ethernet and low-power transceiver support, helping shorten development time for high-speed systems.
Why Choose 10AX115N3F40I2SG?
The 10AX115N3F40I2SG combines high logic density, large embedded memory, and a broad I/O complement in a compact industrial-grade FCBGA package, making it well suited for midrange designs that require substantial programmable logic and on-chip storage. Its inclusion in the Arria 10 family aligns the device with documented family features such as power-management capabilities, dynamic reconfiguration, and high-speed interface IP.
This device is appropriate for engineers and system designers building wireless, wireline, broadcast, and compute/storage systems who need a scalable, power-conscious FPGA platform backed by Arria 10 family documentation and device-level specifications.
Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the 10AX115N3F40I2SG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018