10AX115N3F45E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 650 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 768 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N3F45E2LG – Arria 10 GX FPGA, 1,150,000 logic elements, 1932‑FCBGA
The 10AX115N3F45E2LG is an Intel Arria 10 GX field‑programmable gate array supplied in a 1932‑ball FCBGA (45×45) surface‑mount package. It delivers a high logic capacity device within the Arria 10 family and is targeted at midrange designs that require substantial programmable logic, on‑chip memory and dense I/O for modern networking, compute and broadcast applications.
As a member of the Arria 10 device family, this device benefits from the series’ 20‑nm architecture and family‑level features described in the device overview, providing a balance of performance and power efficiency for power‑sensitive midrange applications.
Key Features
- Logic Capacity — 1,150,000 logic elements to implement large custom logic, control and processing pipelines.
- Embedded Memory — 68,857,856 total RAM bits of on‑chip memory to support large frame buffers, caches and packet buffering.
- High‑Density I/O — 768 user I/Os for extensive external device interfacing, multi‑channel PHY connections or parallel bus architectures.
- Power and Core Voltage — Core supply range of 870 mV to 930 mV, enabling operation within the documented low‑voltage domain of the device.
- Package and Mounting — 1932‑BBGA / 1932‑FCBGA (45×45) surface‑mount package that supports compact, high‑density PCB layouts.
- Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental regulatory alignment.
- Arria 10 Family Capabilities — Series‑level features include adaptive logic modules, variable‑precision DSP blocks, embedded memory configurations, flexible clocking and PLLs, and high‑speed transceiver/PCIe/10 GbE hard IP as described in the Arria 10 device overview.
Typical Applications
- Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul where programmable logic and on‑chip memory enable protocol adaptation and acceleration.
- Wireline and Optical Networking — 40G/100G muxponder and transponder line cards, bridging and aggregation functions requiring high I/O density and on‑device buffering.
- Broadcast and Pro AV — Studio switches and professional audio/video processing that benefit from large internal memory and configurable signal paths.
- Compute and Storage Acceleration — Flash cache and server acceleration tasks that leverage dense logic and embedded memory to offload specialized workloads.
- Medical and Imaging — Diagnostic imaging and scanner control systems that require configurable pipelines and substantial on‑chip memory for frame processing.
Unique Advantages
- High logic density: 1,150,000 logic elements provide headroom for complex, multi‑domain designs and feature integration on a single device.
- Large on‑chip memory: 68,857,856 total RAM bits reduce external memory dependence and simplify board‑level memory architectures.
- Extensive I/O connectivity: 768 I/Os enable multiple high‑speed interfaces or large parallel buses without compromising routing flexibility.
- Compact system footprint: 1932‑FCBGA (45×45) surface‑mount package supports dense PCB layouts while keeping system BOM streamlined.
- Design documentation available: Arria 10 device handbook and device‑level errata/design recommendations are part of the series documentation for informed design integration.
- Extended operating grade: 0 °C to 100 °C rating for designs that require broader commercial temperature operation.
Why Choose 10AX115N3F45E2LG?
The 10AX115N3F45E2LG combines the Arria 10 family’s 20‑nm architecture and series‑level capabilities with a very large logic and memory footprint and a high I/O count, making it well suited for midrange applications that demand substantial programmable resources without multiple discrete devices. Its extended grade and documented family resources support complex system designs that require both performance and power‑aware operation.
Choose this device for designs requiring integrated memory capacity, dense I/O, and a single‑device approach to networking, compute acceleration, imaging or broadcast processing, backed by Arria 10 series documentation and configuration options.
Request a quote or submit an inquiry to receive pricing and availability for the 10AX115N3F45E2LG.

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