10AX115N3F40I2SGE2

The 10AX115N3F40I2SGE2 is an Intel Arria 10 GX family FPGA offering a 20 nm mid-range architecture optimized for high-performance, power-sensitive applications. It combines dense programmable logic, large embedded memory capacity, and extensive I/O to address demanding midrange systems.

This device is suited for diverse markets including wireless and wireline communications, broadcast, computing and storage, medical imaging, and military applications where performance, integration and operating range are key design considerations.

Key Features

• Core Logic — 1,150,000 logic elements to implement complex, high-density designs and large custom logic functions.
• Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, frame storage, and memory-intensive algorithms.
• I/O Capacity — 600 general-purpose I/O pins to interface with high-pin-count systems, external memory, and peripherals.
• Transceivers & High-Speed Interfaces — Family-level features include low-power serial transceivers and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, plus PCIe Gen1/Gen2/Gen3 hard IP.
• Clocking and PLLs — Rich clock networks with fractional synthesis and I/O PLLs to support complex timing and multi-clock domains.
• Power — Operates from a core voltage supply range of 870 mV to 930 mV, enabling designs targeting power efficiency.
• Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) package in a surface-mount form factor for board-level integration.
• Industrial Temperature Range — Specified for −40 °C to 100 °C operation for deployment in extended-temperature environments.
• Compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul where dense logic and on-chip memory support signal processing and protocol handling.
• Wireline networking: 40G/100G muxponders, transponders and line cards using the device’s high-speed interface hard IP and plentiful I/O.
• Broadcast systems: Studio switches and video processing appliances leveraging large on-chip memory and flexible I/O routing.
• Computing and storage: Server acceleration, flash cache and cloud compute modules that benefit from the device’s logic density and embedded RAM.
• Medical imaging and diagnostic equipment: On-board processing and buffering in diagnostic scanners where performance and industrial temperature operation are required.

Unique Advantages

• High logic density: 1,150,000 logic elements enable implementation of large, integrated digital systems on a single device.
• Large on-chip RAM: Nearly 69 million RAM bits reduce external memory dependence for high-throughput buffering and real-time processing.
• Extensive I/O and high-speed connectivity: 600 I/Os plus family-level transceiver and hard IP support simplify system-level interface design for high-bandwidth links.
• Designed for efficiency: Core voltage operation between 870 mV and 930 mV and family-level power-saving technologies support power-sensitive designs.
• Extended operating range: Specified −40 °C to 100 °C temperature rating and surface-mount FCBGA package support deployment in varied environments.

Why Choose 10AX115N3F40I2SGE2?

The 10AX115N3F40I2SGE2 positions designers to consolidate complex processing, large memory requirements, and high-bandwidth I/O into a single, industrial-temperature FPGA. Its combination of high logic element count, substantial embedded RAM, and extensive I/O makes it suitable for midrange systems that demand both performance and power efficiency.

Built on the Intel Arria 10 device family architecture, this device benefits from the family-level features and documentation aimed at accelerating hardware design, system integration, and long-term maintainability in communications, broadcast, computing, medical and defense-oriented applications.

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