10AX115N3F45E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,100 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 768 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N3F45E2SG – Arria 10 GX FPGA, 1932‑FCBGA (45×45)
The 10AX115N3F45E2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) supplied in a 1932‑FCBGA (45×45) surface‑mount package. It delivers a high‑density, mid‑range FPGA architecture optimized for performance and power efficiency in applications across wireless, wireline, broadcast, computing, storage, medical and military markets.
Key on‑chip resources include 1,150,000 logic elements, 68,857,856 bits of embedded RAM, and up to 768 I/Os, making this device suitable for demanding, power‑sensitive designs that require large logic capacity, extensive memory, and flexible I/O and transceiver capabilities.
Key Features
- Logic Capacity — 1,150,000 logic elements to implement complex custom logic, accelerators, or large state machines.
- Embedded Memory — 68,857,856 total RAM bits across on‑chip memory blocks for high‑bandwidth buffering, caches, and packet processing.
- I/O and Packaging — Up to 768 I/Os in a 1932‑FCBGA (45×45) package; surface mount mounting type for high‑density board designs.
- Power and Thermal — Core voltage supply range 870 mV to 930 mV and operating temperature 0 °C to 100 °C; designed with power‑saving technologies described in the Arria 10 family documentation.
- DSP and Compute — Variable‑precision DSP blocks and adaptive logic modules for arithmetic, signal processing, and algorithm acceleration (feature detailed in device overview).
- High‑Speed Interfaces — Low‑power serial transceivers, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and PCIe Gen1/Gen2/Gen3 hard IP as described in the Arria 10 device overview.
- Clocking and Reconfiguration — Multi‑level clock networks, fractional synthesis and I/O PLLs, plus support for dynamic and partial reconfiguration (documented in the device overview).
- Grade and Compliance — Extended grade device with RoHS compliance for regulatory and environmental considerations.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where high logic density and transceiver support are required.
- Wireline Communications — 40G/100G muxponders, transponders and line cards leveraging embedded memory and hard IP for high‑speed data paths.
- Broadcast & Professional AV — Studio switches and video transport systems that need large on‑chip memory and deterministic processing.
- Computing and Storage Acceleration — Server acceleration, flash cache, and cloud computing server offload tasks using DSP resources and high‑capacity logic.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications leveraging the device’s compute density and reconfiguration capabilities.
Unique Advantages
- High Logic Density: 1,150,000 logic elements provide the headroom to consolidate functions and reduce external components.
- Large On‑Chip Memory: 68,857,856 bits of embedded RAM support large buffers and low‑latency data paths without external memory dependence.
- Flexible I/O and Packaging: 768 I/Os in a 1932‑FCBGA (45×45) surface‑mount package enable dense board integration and high pin‑count designs.
- Integrated High‑Speed Protocols: Built‑in hard IP for PCIe and enhanced PCS for Interlaken and 10 Gbps Ethernet reduces implementation time for common high‑speed interfaces.
- Power‑Aware Design: Part of the Arria 10 family optimized for power efficiency through documented power‑saving technologies, helping lower system power for mid‑range applications.
- Reconfiguration and Clocking: Support for dynamic and partial reconfiguration plus advanced PLL and clock network features aids flexible system designs and runtime adaptability.
Why Choose 10AX115N3F45E2SG?
The 10AX115N3F45E2SG positions itself as a high‑capacity, power‑conscious mid‑range FPGA tailored for designs that require significant logic, on‑chip memory, and extensive I/O. Its Arria 10 GX architecture and documented features—such as DSP blocks, transceivers, and PCIe/ethernet hard IP—make it well suited for communications, broadcast, compute acceleration, and other performance‑sensitive markets.
For engineering teams targeting scalable, reconfigurable hardware with robust vendor documentation and extended operating grade, this device offers a combination of integration, performance, and flexibility to support advanced system architectures throughout development and deployment.
Request a quote or submit a sales inquiry to evaluate 10AX115N3F45E2SG for your next design.

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