10AX115N3F45I2SGE2

IC FPGA 768 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 112 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N3F45I2SGE2 – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX115N3F45I2SGE2 is an Intel Arria 10 GX series FPGA — a 20 nm mid-range, high-performance and power-efficient programmable device intended for demanding embedded and communications applications. This device integrates a large logic fabric, substantial on-chip memory, and extensive I/O to address midrange use cases that require high throughput and flexible system integration.

Target markets for the Arria 10 family include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems. The device combines performance, power-management features, and platform-level capabilities described in the Arria 10 device documentation.

Key Features

  • Logic Capacity  Approximately 1,150,000 logic elements, providing a large programmable fabric for complex digital designs.
  • Embedded Memory  68,857,856 total RAM bits of on-chip memory to support large buffers, caches, and fast local storage.
  • I/O Density  768 device I/O pins to enable dense interfacing with external peripherals and memory subsystems.
  • Package & Mounting  1932-ball FCBGA package (45 × 45 mm) with surface-mount mounting for high-pin-count board designs.
  • Power Supply  Core supply range specified from 870 mV to 930 mV for the device core domain.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C suitable for temperature-challenging deployments.
  • Family-Level Capabilities  Arria 10 devices include architectural features such as variable-precision DSP blocks, embedded memory blocks, clock networks and PLL clock sources, serial transceivers, and hard IP for interfaces like PCIe and high-speed Ethernet, as documented in the Arria 10 device overview.
  • Power Efficiency  Designed as a mid-range device family that balances high performance with power-saving technologies, per the Arria 10 device documentation.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high I/O support RF front-end and baseband interfacing.
  • Wireline Networking  40G/100G muxponders, transponders, and line cards requiring high-throughput packet processing and flexible protocol handling.
  • Broadcast & Professional AV  Studio switches, transport and video processing systems that need low-latency processing and substantial on-chip memory for frame buffering.
  • Computing & Storage Acceleration  Cloud server acceleration, flash cache controllers, and storage front-end functions that benefit from high logic density and embedded memory.
  • Medical & Industrial Systems  Diagnostic imaging and other industrial-grade applications that require the device’s operating temperature range and robust I/O capability.

Unique Advantages

  • High Logic Density: With roughly 1.15 million logic elements, the device supports complex algorithms and large-scale FPGA designs without partitioning across multiple devices.
  • Large On-Chip Memory: Nearly 69 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates local data processing.
  • Extensive I/O Count: 768 I/O pins enable high-bandwidth connections to external components, memory interfaces, and multi-lane transceivers.
  • Industrial Temperature Rating: Rated for −40 °C to 100 °C operation, allowing deployment in temperature-challenging environments.
  • Compact, High-Pin Package: 1932-FCBGA (45 × 45 mm) delivers a high pin count in a surface-mount form factor suitable for dense PCB layouts.
  • Documented Platform Features: Benefits from the Arria 10 device family’s documented features such as DSP blocks, PLL clocking, transceiver and hard IP support, and power-management technologies.

Why Choose 10AX115N3F45I2SGE2?

The 10AX115N3F45I2SGE2 positions itself as a high-capacity, mid-range FPGA solution within the Intel Arria 10 GX family, combining a very large logic fabric, substantial embedded memory, and abundant I/O in a single FCBGA package. These characteristics make it suitable for engineers designing midrange systems that require significant on-chip resources and flexible interfacing options.

Designed with power efficiency and performance in mind, and supported by the Arria 10 device documentation and design resources, this device is targeted at applications in communications, broadcast, computing acceleration, medical imaging, and other environments that demand a robust, programmable hardware platform.

Request a quote or submit an inquiry for pricing and availability to evaluate 10AX115N3F45I2SGE2 for your next design project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up