10AX115N3F45I2LG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 258 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N3F45I2LG – Arria 10 GX FPGA (1,150,000 logic elements, 768 I/O)

The 10AX115N3F45I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1932-FCBGA (45×45) package, designed for mid-range, high-performance, power-sensitive applications. As part of the Arria 10 device family built on a 20 nm process, it combines high logic density with substantial embedded memory and a large I/O count to address demanding communications, broadcast, computing, and industrial systems.

This industrial-grade, surface-mount device delivers a balance of performance and power efficiency for designs that require extensive programmable logic, large on-chip RAM, and a wide operating temperature range.

Key Features

  • Core Logic  1,150,000 logic elements provide high-density programmable logic for complex designs and large-scale integration.
  • Embedded Memory  68,857,856 total RAM bits of on-chip memory to support buffering, caching, and state storage without relying exclusively on external memory.
  • I/O Capacity  768 I/O pins to support dense external connectivity and multiple high-speed interfaces.
  • Transceiver/Family Capabilities  Member of the Intel Arria 10 device family (GX series), offering the family-level attributes of higher mid-range performance and power-efficiency described in Intel documentation.
  • Power Supply  Device core voltage supply range of 870 mV to 930 mV as specified for reliable operation within designed power parameters.
  • Package & Mounting  1932-ball FCBGA package (1932-BBGA, supplier package 1932-FCBGA 45×45) for high pin-count, surface-mount board implementations.
  • Industrial Temperature Range  Specified to operate from −40 °C to 100 °C for applications that require extended temperature tolerance.
  • Environmental Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards for remote radio heads and mobile backhaul where dense logic and on-chip memory help implement baseband and control functions.
  • Wireline and Optical Networking  40G/100G muxponders, transponders, and 100G line cards that require substantial programmable logic and high I/O counts for packet processing and protocol handling.
  • Broadcast and Professional AV  Studio switches, transport, and videoconferencing systems leveraging large on-chip RAM and logic for real-time media processing and routing.
  • Computing and Storage Acceleration  Flash cache, cloud server acceleration, and server offload functions where integrated logic and memory reduce external component needs and improve throughput.

Unique Advantages

  • High logic density: 1,150,000 logic elements let you implement large, complex designs on a single device, minimizing board-level complexity.
  • Substantial on-chip RAM: 68,857,856 total RAM bits reduce dependence on external memory for buffering and help lower system latency.
  • Extensive I/O resources: 768 I/O pins support multiple interfaces and dense connectivity, simplifying multi-channel designs.
  • Industrial temperature range: −40 °C to 100 °C rating enables deployment in environments with wide temperature variations.
  • Compact, high-pin-count package: 1932-FCBGA (45×45) provides the pin density required for complex system integration in a surface-mount form factor.
  • RoHS compliant: Environmentally compliant construction supports modern manufacturing and regulatory requirements.

Why Choose 10AX115N3F45I2LG?

The 10AX115N3F45I2LG positions itself as a capable, industrial-grade mid-range FPGA offering high logic capacity, large embedded memory, and a high I/O count in a single 1932-FCBGA package. It is suitable for engineers designing data-plane and control-plane functions in communications, broadcast, and compute-acceleration applications that require scalable programmable resources and extended temperature operation.

As part of the Intel Arria 10 family, this device aligns with a documented device ecosystem focused on performance and power efficiency, enabling you to leverage family-level design guidance and documentation for hardware and software development.

If you would like pricing or availability, request a quote or submit a pricing inquiry and our team will respond with next steps for procurement and lead-time information.

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