10AX115N3F45I2SGES

The 10AX115N3F45I2SGES is an Intel Arria 10 GX field-programmable gate array (FPGA) IC built on the Arria 10 device family. It delivers a high-density, 20 nm mid-range FPGA architecture intended for high-performance, power-sensitive midrange applications across wireless, wireline, broadcast, computing, medical and military markets.

With 1,150,000 logic elements, extensive embedded memory and large I/O capability in a compact 1932-FCBGA package, this device targets designs requiring a balance of performance, integration and power efficiency.

Key Features

• Core Logic — 1,150,000 logic elements providing high logic density for complex digital designs.
• Embedded Memory — 68,857,856 total RAM bits for on-chip data buffering, frame storage and workspace memory.
• I/O Capacity — 768 I/O pins to support wide parallel interfaces and multiple external memory or peripheral connections.
• Package & Mounting — 1932-FCBGA (45×45) package in surface-mount format for high pin-count, compact board implementations.
• Power Supply — Core voltage range 870 mV to 930 mV, suitable for the device’s 20 nm FPGA power architecture.
• Operating Temperature — Rated for −40 °C to 100 °C operation for industrial-environment deployments.
• Integrated High-Speed Features (Series Level) — Arria 10 family features include low-power serial transceivers, PCIe Gen1/2/3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet.
• Power Efficiency — Part of the Arria 10 family designed for improved power efficiency using family-level power-saving technologies.
• Compliance — RoHS-compliant device.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and transceiver support.
• Wireline Networking — 40G/100G muxponders, transponders and 100G line cards where embedded memory and high-speed serial interfaces are required.
• Broadcast & Professional AV — Studio switches and video transport equipment utilizing large on-chip memory and extensive I/O connectivity.
• Computing & Storage — Server acceleration, flash cache and cloud computing server applications that benefit from high logic capacity and integrated interfaces.
• Medical & Military Systems — Diagnostic imaging, radar and secure communications that require rugged operating temperature range and high processing integration.

Unique Advantages

• High logic density: 1,150,000 logic elements enable consolidation of complex functions and larger designs onto a single device, reducing system BOM.
• Substantial on-chip memory: Nearly 69 Mb of embedded RAM supports frame buffering, packet processing and large data working sets without immediate external memory dependency.
• Extensive I/O capability: 768 I/O pins provide flexibility for rich front-end interfaces, wide buses, and multi-channel connectivity.
• Industrial temperature range: −40 °C to 100 °C rating makes the device suitable for demanding environmental deployments.
• Compact high-pin-count package: 1932-FCBGA (45×45) offers high interconnect density in a board-friendly surface-mount form factor.
• Arria 10 family integration: Family-level features such as low-power serial transceivers, PCIe hard IP and enhanced PCS hard IP support high-speed networking and protocol offload.

Why Choose 10AX115N3F45I2SGES?

The 10AX115N3F45I2SGES positions itself as a high-capacity Arria 10 GX FPGA option that balances performance, embedded memory and I/O count in a single compact FCBGA package. It is suited to engineers building power-sensitive, high-throughput midrange systems where on-chip resources and industrial temperature operation are important.

As part of the Intel Arria 10 family, this device benefits from documented device features and family-level capabilities that support scalable designs and professional development flows.

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