10AX115N2F40I1SG

The 10AX115N2F40I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1517‑FBGA surface‑mount package. As part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, this device targets high‑performance, power‑sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

With 1,150,000 logic elements, 68,857,856 bits of embedded RAM and up to 600 I/O pins, the device delivers substantial integration for complex system designs while operating across a wide industrial temperature range and a core supply range of 870 mV to 980 mV.

Key Features

• Logic Capacity  1,150,000 logic elements to implement large-scale digital logic, control, and signal processing functions.
• Embedded Memory  68,857,856 total RAM bits of on‑chip memory to support buffering, large lookup tables, and complex state machines.
• I/O Density  Up to 600 I/O pins in a 1517‑FBGA package for broad external connectivity and high‑speed interfacing.
• Package & Mounting  1517‑BBGA / 1517‑FCBGA (1517‑FCBGA, 40×40) surface‑mount package suitable for dense board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Supply Voltage  Core voltage range of 870 mV to 980 mV to match platform power architectures.
• Arria 10 Series Capabilities  Series features include variable‑precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, low‑power serial transceivers, and hard IP such as PCIe (Gen1/Gen2/Gen3) and Ethernet support as documented for Arria 10 devices.

Typical Applications

• Wireless Infrastructure  Channel and switch cards or mobile backhaul equipment that require high logic density and extensive I/O.
• Wireline Networking  Line cards, muxponders and transponders (40G/100G) where embedded memory and transceiver capabilities support high‑speed data paths.
• Broadcast & Video  Studio switches and professional audio/video processing that leverage large on‑chip RAM and DSP resources.
• Computing & Storage  Server acceleration, flash cache and cloud infrastructure elements needing high logic capacity and flexible I/O.
• Medical & Defense Systems  Diagnostic imaging, radar and secure communications that benefit from industrial temperature operation and system integration.

Unique Advantages

• High integration density: 1,150,000 logic elements combined with 68,857,856 bits of embedded RAM reduce external components and board area for complex designs.
• Extensive I/O support: Up to 600 I/O pins enable broad connectivity options for multi‑lane interfaces, memory subsystems and peripheral integration.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in harsh or temperature‑variable environments.
• Flexible power envelope: Core supply range of 870 mV–980 mV aligns with modern power architectures and scalable performance modes.
• Platform capabilities from the Arria 10 family: Series features such as DSP blocks, PLLs, transceivers and hard IP provide a capable architectural foundation for high‑performance, power‑sensitive designs.

Why Choose 10AX115N2F40I1SG?

The 10AX115N2F40I1SG delivers substantial programmable logic, large embedded memory, and high I/O density in a compact 1517‑FBGA package with industrial temperature rating. It is positioned for mid‑range systems that require a balance of performance, integration and power efficiency offered by the Arria 10 device family.

Designers working on wireless and wireline infrastructure, high‑performance video or compute acceleration will find the device’s capacity and Arria 10 series capabilities suited to scalable, long‑lifecycle projects where integration and thermal robustness matter.

Request a quote or submit an inquiry to get pricing and availability for the 10AX115N2F40I1SG and discuss how it fits your next design.