10AX115U2F45I2SGES

IC FPGA 480 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,407 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U2F45I2SGES – Arria 10 GX FPGA (1932‑FCBGA, Industrial)

The 10AX115U2F45I2SGES is an Intel Arria 10 GX field‑programmable gate array offered in a high‑density 1932‑FCBGA (45×45) package for surface‑mount applications. As a 20‑nm mid‑range FPGA family member, it targets high‑performance, power‑sensitive designs across communications, computing, broadcast and defense markets.

This device provides a large programmable fabric—1,150,000 logic elements—combined with 68,857,856 bits of embedded RAM and 480 I/O pins, delivering the integration and I/O density needed for complex system designs while operating across an industrial temperature range and low core voltage domain.

Key Features

  • High Logic Capacity  1,150,000 logic elements to implement large, complex digital designs and system integration within a single FPGA.
  • Large Embedded Memory  68,857,856 bits of on‑chip RAM to support buffering, caches, and high‑throughput data paths without immediate external memory dependence.
  • Rich I/O  480 device I/Os for broad external interface support and system connectivity.
  • Low‑Voltage Core  Core supply range of 0.870 V to 0.980 V to support energy‑efficient operation in power‑sensitive designs.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation for use in industrial and harsh‑environment applications.
  • Package and Mounting  1932‑FCBGA (45×45) surface‑mount package for high‑density board integration.
  • Arria 10 Family Capabilities  Family features include adaptive logic modules, variable‑precision DSP blocks, embedded memory architectures, PLL and clock networks, and support for high‑speed serial and protocol hard IP as described in the Arria 10 device overview.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile‑backhaul equipment where high logic density and power efficiency are required.
  • High‑Speed Wireline  40G/100G muxponder and line‑card designs that benefit from on‑chip memory, programmable logic, and high I/O counts.
  • Compute and Storage Acceleration  Cloud servers and flash cache acceleration applications that need large FPGA fabrics and embedded RAM for offload and low‑latency processing.
  • Broadcast and Professional AV  Studio switching and video processing systems requiring flexible logic and extensive interfacing.
  • Defense and Secure Communications  Radar, electronic warfare, and secure communications systems that rely on reconfigurable logic and industrial temperature operation.

Unique Advantages

  • Highly scalable logic capacity: 1,150,000 logic elements enable consolidation of multiple functions and complex algorithms into a single programmable device.
  • Substantial on‑chip memory: 68,857,856 bits of embedded RAM reduce dependency on external memory for many buffering and caching use cases.
  • Broad external connectivity: 480 I/Os deliver flexibility for multi‑lane interfaces, control paths, and peripheral integration.
  • Power‑aware operation: Low core voltage range (0.870–0.980 V) combined with Arria 10 family power‑saving technologies supports energy‑sensitive designs.
  • Industrial robustness: −40 °C to 100 °C rating and surface‑mount 1932‑FCBGA packaging support deployment in demanding environments.
  • Proven device family features: Arria 10 family architecture provides DSP blocks, embedded memory types, clocking resources, and protocol hard IP options to accelerate development.

Why Choose 10AX115U2F45I2SGES?

The 10AX115U2F45I2SGES Arria 10 GX FPGA combines high logic density, substantial embedded RAM, and extensive I/O in a single industrial‑grade FCBGA package. It is positioned for mid‑range, high‑performance, and power‑sensitive applications that require significant on‑chip resources and reliable operation across a wide temperature range.

Designers seeking scalability, integration, and the Arria 10 family’s platform capabilities will find this device suitable for communication systems, compute acceleration, broadcast and defense applications where a balance of performance and efficiency is required.

Request a quote or submit a purchase inquiry to get pricing and availability details for 10AX115U2F45I2SGES.

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