10AX115U2F45I2SG

The 10AX115U2F45I2SG is an Intel Arria 10 GX series FPGA device implemented in a 1932‑ball FCBGA (45×45) surface‑mount package. It is a 20‑nm mid‑range FPGA offering a combination of high logic density, substantial embedded memory, and flexible I/O for demanding, power‑sensitive applications.

Targeted markets include wireless and wireline communications, broadcast, compute and storage, medical imaging, and military systems. The device balances performance and power efficiency while providing the integration needed for complex system designs.

Key Features

• Core Logic  1,150,000 logic elements providing substantial programmable logic capacity for complex designs and high‑density integration.
• Embedded Memory  68,857,856 total RAM bits to support large buffers, on‑chip caches, and data‑heavy processing tasks.
• I/O Resources  480 user I/O pins to interface with a wide range of peripherals and external memory devices.
• Package and Mounting  1932‑BBGA (FCBGA) 45×45 package in a surface‑mount form factor for PCB integration and high‑pin‑count routing.
• Voltage and Power  Specified core voltage supply range of 870 mV to 980 mV, enabling designs that target the Arria 10 family power architecture.
• Operating Temperature  Industrial operating temperature range from −40 °C to 100 °C for use in temperature‑wide environments.
• Series Features  Arria 10 family features described in the device overview include adaptive logic modules, variable‑precision DSP blocks, embedded memory structures, clock networks and PLLs, external memory interface support, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers.
• Compliance  RoHS‑compliant for environmental and manufacturing consistency.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul applications that require high logic density and efficient on‑chip memory.
• Wireline Networking  40G/100G muxponders, transponders and line cards where PCIe and high‑speed serial connectivity, plus programmable logic, enable flexible packet processing and aggregation.
• Broadcast and Media  Studio switching, video transport, and professional audio/video processing leveraging the device’s memory and DSP capabilities.
• Compute and Storage  Server acceleration, flash cache and cloud compute use cases that benefit from on‑chip memory and programmable logic for custom acceleration tasks.
• Medical and Defense Systems  Diagnostic imaging, radar, and secure communications where the device’s performance, memory capacity, and industrial temperature range support rugged and high‑demand deployments.

Unique Advantages

• High Integration:  Over 1.15 million logic elements and nearly 69M RAM bits reduce external component count and simplify system architecture.
• Flexible High‑Speed I/O:  480 I/O pins combined with the Arria 10 family’s serial transceiver and PCS hard IP support enable a wide range of high‑bandwidth interfaces.
• Power‑Aware Design:  Family‑level power features and a specified core voltage range support designs that target efficient power profiles.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployments that require extended temperature operation.
• Comprehensive Series Features:  Arria 10 device family capabilities—such as DSP blocks, clock networks, external memory interfaces, and PCIe hard IP—provide a broad toolset for system designers.
• Standards and Documentation:  The device is part of an established Intel Arria 10 family with associated documentation and design guidance referenced in the device overview.

Why Choose 10AX115U2F45I2SG?

The 10AX115U2F45I2SG positions itself as a high‑capacity, mid‑range FPGA optimized for applications that demand a balance of performance, on‑chip memory, and flexible I/O in a single device. Its Arria 10 family capabilities—including DSP resources, embedded memory, and high‑speed serial interfaces—make it suitable for mid‑to‑high complexity designs across communications, compute, and imaging markets.

For teams building power‑sensitive, high‑throughput systems, this device provides the integration and thermal range needed to scale prototypes into deployed systems while relying on the Arria 10 device documentation and family support for design development.

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