10AX115U2F45E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 116 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115U2F45E2LG – Arria 10 GX FPGA, 1,150,000 logic elements
The Intel 10AX115U2F45E2LG is an Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1932-FCBGA (45×45) surface-mount package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed to deliver high performance with power-efficiency for demanding mid-range applications.
With 1,150,000 logic elements, 68,857,856 total RAM bits, and 480 I/Os, this extended-grade device targets applications in wireless and wireline infrastructure, broadcast, computing and storage, and other markets where high logic density and integrated memory are required. The device operates from 0 °C to 100 °C with a core supply range of 870 mV to 980 mV and is RoHS compliant.
Key Features
- Core Logic — 1,150,000 logic elements provide high logic density for complex FPGA designs and large-scale integration.
- Embedded Memory — 68,857,856 total RAM bits to support large buffering, on-chip caches, and memory-intensive algorithms.
- I/O and Interfaces — 480 general-purpose I/Os for wide external connectivity and flexible board-level interfacing.
- Package and Mounting — 1932-FCBGA (45×45) ball-grid array in a surface-mount package suitable for compact system designs.
- Power and Thermal — Core voltage supply range 870 mV to 980 mV and operating temperature range 0 °C to 100 °C for extended-grade deployments.
- Standards and Compliance — RoHS compliant.
- Platform Features (Arria 10 family) — Delivered on a 20 nm architecture that emphasizes performance and power efficiency; suitable for mid-range systems and SoC integration as described in the Arria 10 device overview.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require high logic density and embedded memory.
- Wireline Communications — 40G/100G muxponders, transponders, and line cards that need programmable logic and extensive I/O resources.
- Broadcast and Media Systems — Studio switching, transport servers, and videoconferencing systems leveraging on-chip memory and high I/O counts.
- Computing and Storage — Flash cache, cloud computing servers, and server acceleration functions where logic density and memory capacity are important.
- Medical and Aerospace Applications — Diagnostic imaging and radar/military systems listed among Arria 10 target markets where performance and power efficiency are required.
Unique Advantages
- High Logic Density: 1,150,000 logic elements enable complex, feature-rich FPGA designs without immediate need for multi-chip solutions.
- Large On-Chip Memory: 68,857,856 total RAM bits support large buffers, packet processing, and stateful algorithms directly on the FPGA fabric.
- Extensive I/O Count: 480 I/Os provide flexible connectivity options for high-pin-count interfaces and board-level integration.
- Compact FCBGA Package: 1932-FCBGA (45×45) package allows dense board layouts while maintaining surface-mount assembly compatibility.
- Extended Operating Grade: 0 °C to 100 °C operating range and RoHS compliance support deployment in commercial and extended environments.
- Power-Efficient 20 nm Platform: Part of the Arria 10 family built on a 20 nm architecture focused on balancing performance and power efficiency for mid-range applications.
Why Choose 10AX115U2F45E2LG?
The 10AX115U2F45E2LG Arria 10 GX FPGA combines very high logic capacity with substantial embedded memory and a large I/O count in a single, surface-mount FCBGA package. Its extended-grade operating range and RoHS compliance make it suitable for a wide range of mid-range, performance-sensitive applications identified by the Arria 10 device family.
Design teams seeking a scalable, high-density programmable platform for wireless and wireline infrastructure, broadcast, computing/storage, or medical/military systems can leverage the device’s logic, memory, and I/O resources to integrate multiple functions and reduce external component count while benefiting from the Arria 10 architecture’s emphasis on performance and power efficiency.
Request a quote or contact sales to discuss pricing, availability, and how the 10AX115U2F45E2LG can fit your next design.

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