10AX115U2F45E2SG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 183 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U2F45E2SG – Arria 10 GX FPGA, 1,150,000 logic elements, 1932-FCBGA

The 10AX115U2F45E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1932-FCBGA (45×45) package. It belongs to the Arria 10 family of 20 nm mid-range FPGAs, delivering a combination of high logic capacity, substantial embedded memory, and advanced I/O for performance-sensitive, power-conscious designs.

This device is suited to a broad set of market segments identified for the Arria 10 family, including wireless infrastructure, high-speed wireline and networking, broadcast, computing and storage, medical imaging, and defense applications where complex logic, embedded memory, and high-density I/O are required.

Key Features

  • Logic Capacity — 1,150,000 logic elements, providing large programmable fabric for complex algorithms and system integration.
  • Embedded Memory — 68,857,856 total RAM bits to support large on-chip buffering, packet processing, and data-path storage.
  • I/O Density — 480 I/O pins to enable extensive external connectivity and multiple memory or interface channels.
  • Package & Mounting — 1932-BBGA / 1932-FCBGA (45×45) surface-mount package for high-density board integration.
  • Power Supply — Core voltage range 870 mV to 980 mV, enabling standard Arria 10 power domains and system-level power planning.
  • Operating Range — Extended temperature grade with operating range 0 °C to 100 °C.
  • Series-Level IP and Fabric — Arria 10 family features such as variable-precision DSP blocks, multiple embedded memory block types, PLL-based clock networks, and support for PCIe Gen1/2/3 hard IP and low-power serial transceivers are part of the device family architecture.
  • Design Flexibility — Supports advanced configuration and reconfiguration features described for the Arria 10 family, including dynamic and partial reconfiguration capabilities.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul, leveraging the device’s logic capacity and transceiver/IP capabilities.
  • Wireline and Networking — 40G/100G muxponders, transponders, line cards, and aggregation where high I/O density and embedded memory support packet buffering and line-rate processing.
  • Broadcast and Professional AV — Studio switching, video transport, and conferencing systems that require flexible I/O mapping and on-chip memory for buffering and format conversion.
  • Computing and Storage — Server acceleration and flash-cache functions that exploit the device’s large logic fabric and embedded RAM for custom offload engines.
  • Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare subsystems that use dense logic, DSP blocks, and high-bandwidth interfaces for signal processing tasks.

Unique Advantages

  • High Logic Scale: 1,150,000 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board-level BOM and interconnect complexity.
  • Large On-Chip Memory: 68,857,856 RAM bits provide ample capacity for packet buffering, frame storage, and data-path acceleration without immediate external memory dependence.
  • Extensive I/O: 480 I/Os support diverse peripheral and high-speed interface requirements, simplifying multi-channel designs.
  • Compact, High-Density Package: 1932-FCBGA (45×45) surface-mount package enables dense PCB implementations while maintaining the device’s high resource count.
  • Arria 10 Family Architecture: Family-level features such as variable-precision DSPs, PLL clocking, PCIe hard IP, and low-power transceivers give designers access to proven building blocks for common high-performance subsystems.
  • Compliance and Thermal Range: RoHS compliance and an extended operating range of 0 °C to 100 °C make the device suitable for many commercial and industrial-adjacent applications.

Why Choose 10AX115U2F45E2SG?

The 10AX115U2F45E2SG positions itself as a high-capacity Arria 10 GX device for designs that require significant programmable logic, abundant on-chip memory, and a large complement of I/O in a single package. Its family-level architecture provides DSP resources, hard IP for high-speed interfaces, and advanced clocking options that accelerate development of networking, signal-processing, and compute-acceleration functions.

This device is suited to system designers and procurement teams targeting mid-range, performance-oriented applications that need scalability, integration, and the Arria 10 family ecosystem for long-term design support and incremental development.

Request a quote or submit an inquiry to receive pricing and availability for the 10AX115U2F45E2SG. Provide your requirements and production volume to get a tailored response.

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