10AX115U2F45I2SGE2
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 499 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115U2F45I2SGE2 – Arria 10 GX FPGA, 1,150,000 Logic Elements, 1932‑FCBGA
The 10AX115U2F45I2SGE2 is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932‑FCBGA package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power‑efficient applications across communications, broadcast, computing, medical, and defense markets.
With 1,150,000 logic elements, abundant on‑chip RAM, and 480 general-purpose I/O pins, this device targets complex, I/O‑intensive systems that require large logic capacity, embedded memory, and configurable system integration while operating over an industrial temperature range.
Key Features
- Logic Capacity — 1,150,000 logic elements for implementing large-scale digital logic, algorithm acceleration, and complex custom datapaths.
- Embedded Memory — 68,857,856 total RAM bits to support large buffers, FIFOs, and on‑chip storage for data‑intensive designs.
- I/O Density — 480 I/O pins to support broad external interfacing, parallel buses, and high‑pin‑count system connections.
- Package and Mounting — 1932‑FCBGA (45×45) package, surface‑mount mounting for high‑density board designs.
- Power and Core Voltage — Core supply range 870 mV to 980 mV to match platform power requirements and support optimized power delivery.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in temperature‑challenging environments.
- Family-Level System Features — Arria 10 family features include variable‑precision DSP blocks, embedded memory block architectures, clock networks and PLLs, PCIe Gen1/2/3 hard IP, low‑power serial transceivers, and enhanced PCS hard IP for Ethernet and Interlaken (features described at the Arria 10 device family level).
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards or mobile backhaul equipment requiring high logic density and programmable datapaths.
- Wireline and Optical Networking — 40G/100G muxponders, transponders, and line cards that need high I/O counts and on‑chip buffering.
- Broadcast and Professional AV — Studio switches and video transport systems that use large embedded memory and configurable logic for signal processing.
- Computing and Storage — Server acceleration, flash caching, and cloud infrastructure functions that leverage DSP blocks and large logic capacity.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications where industrial temperature operation and integration flexibility are required.
Unique Advantages
- High Logic Density: 1,150,000 logic elements enable complex system integration and consolidation of multiple functions into a single device, reducing board-level BOM.
- Substantial On‑Chip Memory: 68,857,856 RAM bits provide large local storage for buffering, packet processing, and real-time data handling without external memory dependence.
- Rich I/O Resources: 480 I/O pins accommodate parallel interfaces and broad connectivity needs for high‑bandwidth system designs.
- Industrial‑Grade Operation: Specified for −40 °C to 100 °C, suitable for deployment in systems exposed to wide temperature ranges.
- Compact, High‑Density Package: 1932‑FCBGA (45×45) packaging supports dense PCB designs while providing the pin count needed for complex systems.
- Family Ecosystem and Features: As part of the Arria 10 family, this device benefits from documented device features such as DSP blocks, PLLs, PCIe hard IP, and serial transceiver capabilities described in the Arria 10 device overview.
Why Choose 10AX115U2F45I2SGE2?
The 10AX115U2F45I2SGE2 positions itself as a high‑capacity, industrial‑grade FPGA option within the Intel Arria 10 family, combining extensive logic resources, large embedded memory, and a high I/O count in a compact FCBGA package. It is suited to designers who need to consolidate complex functions, accelerate algorithms in hardware, and support demanding I/O and buffering requirements while operating across a wide temperature range.
Supported by Arria 10 family documentation and device-level feature sets, this FPGA offers a practical path for mid‑range systems that require scalable performance, configurable integration, and a documented development ecosystem.
If you would like pricing, availability, or a formal quote for 10AX115U2F45I2SGE2, submit an inquiry or request a quote and our team will respond with the details you need.

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