10AX115U3F45I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 434 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115U3F45I2LG – Arria 10 GX Field Programmable Gate Array (FPGA), 1932-FCBGA
The 10AX115U3F45I2LG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 1932-FCBGA (45 × 45 mm) package for surface-mount applications. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed to deliver high performance with power-efficiency for demanding embedded and communications designs.
With 1,150,000 logic elements, 68,857,856 total RAM bits, and 480 user I/O pins, this industrial-grade device targets mid-range applications that require significant logic density, on-chip memory and connectivity while operating across an extended temperature range.
Key Features
- High logic density — 1,150,000 logic elements to implement complex digital functions and large-scale custom logic.
- On-chip memory — 68,857,856 total RAM bits for large buffering, caching, and packet or data processing workloads.
- Rich I/O count — 480 user I/O pins to support broad peripheral, memory and high-speed interface connectivity.
- Arria 10 GX architecture — Part of the Intel Arria 10 family (20 nm) offering architectures and features documented for high performance and power efficiency.
- Transceivers and protocol IP (series-level) — Series documentation includes low-power serial transceivers, PCIe Gen1/2/3 hard IP, and 10 Gbps Ethernet/Interlaken support as part of the Arria 10 capabilities.
- DSP and clocking resources (series-level) — Variable-precision DSP blocks, adaptive logic modules, and extensive clock networks with PLLs are defined in the Arria 10 device family documentation.
- Industrial grade and operating range — Specified operating temperature from −40 °C to 100 °C and RoHS compliant for regulated manufacturing.
- Power supply range — Core voltage specified between 870 mV and 930 mV to support the device’s core operating requirements.
- Package and mounting — 1932-BBGA (1932-FCBGA, 45×45) surface-mount package optimized for high-density board designs.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul implementations leveraging on-chip logic and transceiver capabilities.
- Wireline networking — 40G/100G muxponders, transponders and line cards where large logic capacity and on-chip memory are required for packet processing and aggregation.
- Broadcast and professional AV — Studio switching, videoconferencing and transport equipment that benefit from high I/O counts and configurable DSP resources.
- Computing and storage acceleration — Flash caching, server acceleration and cloud compute offload where dense logic and embedded RAM enable custom acceleration functions.
- Medical and industrial systems — Diagnostic imaging and other industrial use cases that require industrial temperature support and large on-chip resources.
Unique Advantages
- Substantial on-chip resources: Combines 1,150,000 logic elements with 68,857,856 RAM bits to reduce external memory dependence and simplify system architecture.
- High I/O connectivity: 480 I/O pins provide flexible interfacing to peripherals, memory devices and high-speed links.
- Industrial temperature support: Rated for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
- Compact, high-density package: 1932-FCBGA (45×45) surface-mount package supports dense PCB layouts while accommodating the device’s I/O and power needs.
- Arria 10 family feature set: Access to Arria 10 series-level capabilities such as DSP blocks, advanced clocking, serial transceivers and PCIe hard IP for protocol offload and high-speed links.
- Regulatory readiness: RoHS compliance for environmentally regulated production environments.
Why Choose 10AX115U3F45I2LG?
The 10AX115U3F45I2LG positions itself as a high-density, industrial-grade Arria 10 GX FPGA option for mid-range designs that require a balance of logic capacity, embedded memory and robust I/O. Its combination of 1,150,000 logic elements, nearly 69 Mbits of on-chip RAM and 480 I/Os supports feature-rich implementations while the documented Arria 10 series capabilities enable integration of DSP, transceiver and protocol IP where needed.
This part is suitable for engineers and procurement teams building communications, broadcast, compute acceleration or industrial systems that need significant programmable logic, extended temperature support and a compact FCBGA footprint backed by Arria 10 family documentation.
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