10AX115U3F45I3SGES

IC FPGA 480 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,107 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U3F45I3SGES – Arria 10 GX FPGA, 1,150,000 logic elements, 68,857,856 RAM bits, 480 I/Os

The Intel Arria 10 GX 10AX115U3F45I3SGES is a 20 nm mid-range, high-performance FPGA device in an industrial-grade surface-mount FCBGA package. It combines large programmable logic capacity, substantial embedded RAM, and broad I/O to address midrange applications that require performance and power efficiency.

Designed for markets such as wireless, wireline, broadcast, computing and storage, and mission-critical systems, this device emphasizes power-efficient operation and integration of advanced transceiver, memory, and clocking capabilities at the device-family level.

Key Features

  • High Logic Density — 1,150,000 logic elements provide extensive programmable capacity for complex FPGA designs and integration of multiple functions on a single device.
  • Large Embedded Memory — 68,857,856 total RAM bits for on-chip buffering, caching, and data-path storage to support high-throughput designs.
  • Extensive I/O — 480 I/O pins to support wide parallel interfaces, rich peripheral connectivity, and multi-channel systems.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments and temperature-sensitive deployments.
  • Power Supply Range — Core voltage specified from 870 mV to 930 mV to match system power-architecture requirements.
  • Package and Mounting — 1932-FCBGA (45×45) package with surface-mount mounting for high-density board integration.
  • Family-Level System Features — Arria 10 device-family features include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, PCIe Gen1/Gen2/Gen3 Hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head processing, and mobile backhaul where programmable logic and high I/O density enable signal processing and interface integration.
  • Wireline Networking — 40G/100G muxponders, transponders, and line cards that leverage the device-family's high-speed serial transceivers and PCIe hard IP for packet and transport applications.
  • Compute and Storage Acceleration — Server offload, flash cache, and cloud acceleration functions that benefit from large on-chip RAM and dense logic for custom data-paths and accelerators.
  • Broadcast and Professional Video — Studio switches and video transport systems that need high-throughput processing and flexible I/O configurations.

Unique Advantages

  • High integration in a single device: Large logic and memory capacities reduce the need for multi-FPGA solutions and simplify board-level BOM and routing.
  • Designed for power-sensitive midrange designs: 20 nm device-family power-saving technologies deliver performance with attention to energy efficiency.
  • Robust industrial operating range: −40 °C to 100 °C rating enables deployment in demanding temperature environments.
  • Broad system-level feature set: Family support for PLLs, hard IP for PCIe and Ethernet, and low-power transceivers speeds system design and reduces external IP integration effort.
  • High I/O bandwidth: 480 I/Os and a 1932-FCBGA package provide the pin count and package density needed for complex multi-interface systems.
  • RoHS compliance: Meets environmental requirements for regulated markets.

Why Choose 10AX115U3F45I3SGES?

The 10AX115U3F45I3SGES Arria 10 GX FPGA targets engineers who need a balance of high logic capacity, large on-chip memory, and industrial robustness. Its combination of 1,150,000 logic elements, 68,857,856 RAM bits, and 480 I/Os in a 1932-FCBGA package supports complex midrange designs where integration, deterministic performance, and power-aware operation matter.

Choosing this device provides scalability within the Arria 10 family and access to family-level capabilities such as DSP resources, advanced clocking, hard IP for high-speed interfaces, and low-power transceivers—helping shorten development cycles and enable long-term platform flexibility.

Request a quote or submit an RFQ to obtain pricing, lead-time, and availability information for 10AX115U3F45I3SGES.

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