10AX115U4F45I3SG

The 10AX115U4F45I3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) device built on the Arria 10 family architecture. It delivers a mid-range 20 nm FPGA architecture that combines a large logic capacity with extensive embedded memory and I/O resources for demanding, power-conscious designs.

With 1,150,000 logic elements, 68,857,856 total RAM bits, and 480 I/O, this device targets wireless, wireline, broadcast, computing/storage, medical and military applications where high logic density, substantial on-chip memory and broad I/O counts are required. The device ships in a 1932‑FCBGA (45×45) package and supports industrial temperature operation.

Key Features

• Core Logic 1,150,000 logic elements providing large on-chip programmable logic capacity for complex FPGA implementations.
• Embedded Memory 68,857,856 total RAM bits of on-chip memory to support large buffers, caches, or lookup tables without external memory for many functions.
• I/O 480 I/O pins to accommodate extensive external interfaces, parallel buses, and board-level connectivity.
• Package 1932‑ball FCBGA package (45×45) offering high pin count in a surface-mount form factor for dense, high‑performance boards.
• Power Supply Core voltage supply range of 870 mV to 930 mV specified for the device core rails.
• Operating Temperature Industrial temperature grade specified from −40 °C to 100 °C for deployment in thermally demanding environments.
• Family Characteristics Part of the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs, a product line described as high-performance and power-efficient in the device overview.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards, remote radio head subsystems and mobile backhaul functions benefitting from on-chip logic density and memory.
• Wireline and optical networking — Line cards, muxponders and transponders that require large logic and memory resources alongside extensive I/O connectivity.
• Broadcast and media — Studio switches, transport and professional audio/video processing where on-chip memory and programmable logic accelerate media paths.
• Computing and storage acceleration — Flash cache, server acceleration and cloud compute offload that use dense logic and embedded RAM for packet processing and data buffering.
• Medical and military systems — Diagnostic imaging, radar and secure communications implementations that require a combination of logic capacity, memory, and industrial temperature operation.

Unique Advantages

• High logic density: 1,150,000 logic elements enable large, complex designs without partitioning across multiple FPGAs.
• Substantial on‑chip memory: Nearly 69 million bits of embedded RAM reduce dependence on external memory for buffering and state storage.
• Extensive I/O capability: 480 I/Os support wide parallel interfaces and multiple external peripherals or PHYs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or industrial environments.
• Compact high‑pin package: 1932‑FCBGA (45×45) provides high connectivity in a surface-mount footprint for dense board layouts.
• Arria 10 family ecosystem: Part of the Intel Arria 10 device family, offering documented device resources and design guidance specific to this 20 nm platform.

Why Choose 10AX115U4F45I3SG?

The 10AX115U4F45I3SG targets designs that require a balance of large programmable logic capacity, significant on‑chip memory, and high I/O count in an industrial-temperature rated package. Its placement in the Intel Arria 10 family reflects the device’s 20 nm architecture and the family-level emphasis on performance and power efficiency.

This device is suited for engineers developing mid-range, high-function systems in networking, broadcast, compute acceleration, and defense/medical markets who need scalable logic and memory resources combined with robust operating-temperature and power-supply specifications.

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