10AX115U4F45E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 521 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115U4F45E3SG – Arria 10 GX FPGA, 1,150,000 logic elements
The 10AX115U4F45E3SG is an Intel Arria 10 GX family field-programmable gate array (FPGA) device. It is part of the 20 nm Arria 10 device family designed for high-performance, power-sensitive midrange applications.
With 1,150,000 logic elements, 68,857,856 bits of on-chip RAM, up to 480 I/O, and industry-focused interface hard IP, this surface-mount FCBGA device (1932‑F C B G A, 45×45) targets communication, compute, broadcast and sensing systems that require high integration and flexible reconfiguration. The device is specified for operation from 0 °C to 100 °C and uses a core supply range of 870 mV to 930 mV.
Key Features
- Core Capacity – 1,150,000 logic elements to implement large, complex logic designs and integrations.
- On‑chip Memory – 68,857,856 total RAM bits of embedded memory for buffering, caching, and on-chip data storage.
- I/O – Up to 480 I/O pins to support broad external interfacing and multi-channel connectivity.
- High‑speed Interfaces & IP – Series-level support includes PCIe Gen1/Gen2/Gen3 hard IP and 10 Gbps Ethernet and Interlaken enabling common high-throughput protocols (as described for the Arria 10 family).
- Transceivers and Clocking – Low-power serial transceivers, PLL clock sources, and flexible clock networks for multi-rate serial links and system timing (Arria 10 family features).
- DSP and Processing – Variable‑precision DSP resources for arithmetic-intensive signal processing functions (Arria 10 family capability).
- Reconfiguration and Reliability – Supports dynamic and partial reconfiguration and includes SEU error detection and correction mechanisms described for the Arria 10 family.
- Package and Mounting – 1932‑FCBGA (45×45) package, surface-mount construction for board-level integration.
- Power and Thermal – Core supply range 870 mV to 930 mV; operating temperature range 0 °C to 100 °C; device is specified as Extended grade.
Typical Applications
- Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul where midrange, power‑sensitive FPGA resources are required.
- Wireline and optical transport: 40G/100G muxponders, transponders, and line cards leveraging high-speed interface hard IP and transceivers.
- Broadcast and Pro AV: Studio switches, video transport and professional audio/video processing using large logic and memory capacity for stream handling.
- Computing and storage acceleration: Flash cache, server acceleration and cloud compute offload that benefit from high logic density and embedded memory.
Unique Advantages
- High integration density: 1,150,000 logic elements and large embedded RAM allow consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
- Broad I/O and protocol support: 480 I/O pins combined with Arria 10 family hard IP for PCIe and 10 Gbps Ethernet streamline interface implementation for communication and compute designs.
- Flexible performance scaling: DSP blocks, configurable clock networks, and low-power transceivers provide design flexibility across signal processing and data‑plane tasks.
- Manufacturable package: 1932‑FCBGA (45×45) surface-mount package supports high-density PCB routing and standard assembly processes.
- Extended-grade operation: Specified for 0 °C to 100 °C and Extended grade, suitable for many commercial and enterprise application environments.
- Reconfiguration and reliability features: Dynamic/partial reconfiguration and SEU detection/correction options enhance in-field updateability and robustness as described for the Arria 10 family.
Why Choose 10AX115U4F45E3SG?
The 10AX115U4F45E3SG positions itself as a high-density, midrange FPGA option within the Intel Arria 10 GX family, offering substantial logic capacity, extensive on-chip memory, and plentiful I/O in a compact FCBGA package. Its combination of protocol hard IP, transceiver support, and reconfiguration features makes it suitable for communications, compute acceleration, and high-throughput signal processing applications where integration and flexibility matter.
Backed by Arria 10 device documentation and family-level resources, the part provides a platform for scalable designs and long-term support through Intel’s published device handbook and device errata resources referenced for the Arria 10 family.
Request a quote or submit a pricing and availability inquiry for part 10AX115U4F45E3SG to receive product pricing, lead times, and ordering details.

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