10AX115U3F45I2SGES

IC FPGA 480 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 129 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U3F45I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements, 1932‑FCBGA

The 10AX115U3F45I2SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1932‑FCBGA (45×45) surface‑mount package. As part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, this device targets high‑performance, power‑sensitive designs across communications, broadcast, compute, medical and defense markets.

With a high logic density and large embedded memory, the device is positioned for applications requiring significant programmable logic, on‑chip RAM and broad I/O connectivity while operating over an industrial temperature range.

Key Features

  • Logic Density — 1,150,000 logic elements for implementing large, complex programmable designs and custom accelerators.
  • Embedded Memory — 68,857,856 total RAM bits of on‑chip memory to support buffering, caches, and deep packet processing.
  • I/O & Package — 480 general I/Os in a 1932‑FBG A / 1932‑FCBGA (45×45) surface‑mount package for high‑pin‑count system interfaces.
  • Power and Supply — Core voltage range 0.870 V to 0.930 V to align with low‑voltage power domains.
  • Temperature and Grade — Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments.
  • Arria 10 Family Capabilities — Built on a 20 nm architecture with family features including embedded memory blocks, variable‑precision DSP blocks, clock networks with PLL sources, and support for dynamic and partial reconfiguration.
  • High‑speed Interfaces and IP — Arria 10 family documentation highlights hard IP and features such as PCIe Gen1/Gen2/Gen3, enhanced PCS for 10 Gbps Ethernet and Interlaken, and low‑power serial transceivers.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems benefit from the device's logic density and embedded memory for signal processing and packet handling.
  • Wireline transport — 40G/100G muxponders, transponders and 100G line cards can leverage the Arria 10 GX family features and high‑speed interface IP for aggregation and line‑rate processing.
  • Broadcast and media — Studio switches, videoconferencing, and professional audio/video systems can use the FPGA for real‑time processing, switching and format conversion tasks.
  • Compute and storage acceleration — Server acceleration, flash cache and cloud compute functions that require custom logic and high memory bandwidth are well matched to the device's resources.
  • Medical and defense systems — Diagnostic imaging, radar, electronic warfare and missile guidance applications can take advantage of the combination of performance, embedded memory and industrial temperature range.

Unique Advantages

  • High programmable capacity: 1,150,000 logic elements enable large custom hardware implementations and complex system integration on a single device.
  • Substantial on‑chip memory: Nearly 69 million bits of RAM reduce reliance on external memory for buffering and accelerators, simplifying board design.
  • Broad I/O and dense packaging: 480 I/Os in a 1932‑FCBGA (45×45) package support high‑pin‑count interfaces while maintaining a surface‑mount form factor.
  • Industrial temperature operation: Rated from −40 °C to 100 °C for deployment in environments with wide thermal ranges.
  • Power‑efficient 20 nm architecture: Arria 10 family design emphasizes power‑saving technologies and low‑voltage core operation to support power‑sensitive applications.
  • Rich system IP and connectivity: Family documentation includes PCIe, high‑speed serial transceiver capabilities and clocking resources to accelerate system integration.

Why Choose 10AX115U3F45I2SGES?

The 10AX115U3F45I2SGES Arria 10 GX FPGA combines high logic density, large embedded memory and extensive I/O in a single industrial‑rated FCBGA package. It is suited to mid‑range, performance‑focused designs where programmable logic, on‑chip RAM and advanced interface IP reduce system complexity and accelerate time to market.

Engineers designing communications, compute, broadcast, medical or defense applications will find the device's resource mix, 20 nm family capabilities and RoHS compliance appropriate for robust, scalable solutions that leverage Arria 10 family features.

Request a quote or submit an inquiry to check availability and pricing for 10AX115U3F45I2SGES and to discuss integration details for your project.

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