10AX115U3F45I2SGE2

IC FPGA 480 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,884 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U3F45I2SGE2 – Arria 10 GX FPGA, 1,150,000 Logic Elements

The 10AX115U3F45I2SGE2 is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1932-FCBGA (45 × 45 mm) package. It delivers a high-density reprogrammable fabric with 1,150,000 logic elements and a large embedded memory footprint for mid-range, performance-sensitive applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications, this industrial-grade device combines high logic capacity, extensive on-chip RAM, and broad I/O to support complex system functions while operating across a wide temperature and voltage range.

Key Features

  • Core Logic – 1,150,000 logic elements provide large programmable fabric for complex digital designs and acceleration tasks.
  • Embedded Memory – 68,857,856 total RAM bits for large on-chip data buffering, frame storage, and lookup tables.
  • I/O Capacity – 480 user I/O pins to interface with high-pin-count external devices and memory subsystems.
  • Voltage Supply – Core supply range of 870 mV to 930 mV to match required power domains and enable stable operation.
  • Package & Mounting – 1932-BBGA / 1932-FCBGA (45 × 45 mm) surface-mount package for dense board integration and thermal management.
  • Temperature & Grade – Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
  • Standards & Compliance – RoHS compliant to meet environmental and regulatory requirements.
  • Arria 10 Family Characteristics – Based on the Arria 10 device family architecture (20 nm mid-range FPGA generation) offering improved performance and power efficiency relative to prior mid-range devices.

Typical Applications

  • Wireless Infrastructure – Channel processing and radio-head logic where high logic density and embedded memory support complex DSP and real-time protocols.
  • Wireline and Optical Networking – Line cards and transponders that require substantial logic resources and I/O to implement packet processing, aggregation, and high-speed protocol handling.
  • Broadcast and Pro AV – Studio switches and video-processing functions that use on-chip RAM for frame buffering and the programmable fabric for custom signal pipelines.
  • Computing and Storage – Server acceleration and flash-cache controllers benefiting from large logic and memory capacity for low-latency data paths and offload engines.
  • Medical and Defense Systems – Diagnostic imaging, radar, and secure communications requiring industrial temperature operation and reprogrammable hardware for algorithm updates.

Unique Advantages

  • High Logic Capacity: 1,150,000 logic elements enable integration of multiple subsystems and sophisticated algorithms on a single device, reducing BOM and interconnect complexity.
  • Large On‑Chip Memory: Nearly 69 million RAM bits support extensive buffering and state storage, minimizing external memory bandwidth requirements.
  • Extensive I/O: 480 I/O pins provide flexibility to connect high-pin-count peripherals, memory interfaces, and high-speed SerDes lanes.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet demanding environmental and system-level reliability needs.
  • Compact, High‑Density Package: 1932-FCBGA (45 × 45 mm) surface-mount package concentrates capability in a single footprint for space-constrained designs.
  • Power-Optimized Operation: Narrow core voltage range (870 mV–930 mV) consistent with modern low-voltage FPGA power domains to support efficient system power architecture.

Why Choose 10AX115U3F45I2SGE2?

The 10AX115U3F45I2SGE2 Arria 10 GX FPGA positions itself for mid-range applications that demand a balance of high logic density, substantial embedded memory, and broad I/O reach while meeting industrial temperature requirements. Its family-level design emphasizes performance and power efficiency, making it suitable for system acceleration, networking, broadcast, and specialized instrumentation.

For engineers and procurement teams seeking a scalable, reprogrammable platform with verifiable specifications—logic capacity, RAM bits, I/O count, operating temperature, and package details—this device provides a well-documented building block with RoHS compliance for long-term deployments.

Request a quote or submit an RFQ to receive pricing and availability information for the 10AX115U3F45I2SGE2 Arria 10 GX FPGA.

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