10AX115U4F45E3LG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,286 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U4F45E3LG – Arria 10 GX FPGA, 1,150,000 logic elements, 68,857,856 RAM bits

The 10AX115U4F45E3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) offered in a 1932-FCBGA (45×45) package. It is part of the Arria 10 device family, a 20 nm mid-range FPGA family targeting high-performance, power-sensitive applications across diverse markets.

Key on-chip resources include 1,150,000 logic elements, 68,857,856 total RAM bits and 480 I/O pins. The device is RoHS compliant, supplied as a surface-mount FCBGA, and rated for extended-grade operation from 0°C to 100°C with a core voltage supply range of 870 mV to 930 mV.

Key Features

  • Core Logic 1,150,000 logic elements provide large programmable logic capacity for complex logic, control and custom data-path implementations.
  • On‑Chip Memory 68,857,856 total RAM bits for distributed and embedded memory storage across multiple functions and buffering needs.
  • I/O Density 480 general-purpose I/O pins to support broad peripheral, memory and high-speed interface connectivity.
  • Packaging & Mounting 1932‑BBGA (1932‑FCBGA, 45×45) surface-mount package intended for high-density board designs.
  • Power & Thermal Core supply operating range 870 mV to 930 mV and an operating temperature window of 0°C to 100°C (Extended grade).
  • Device Family Capabilities Arria 10 family features documented in the device overview include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, PCIe hard IP, low‑power serial transceivers and support for dynamic/partial reconfiguration.
  • Compliance RoHS compliant to support environmentally restricted material requirements.

Typical Applications

  • Wireless Infrastructure Channel and switch card designs and mobile backhaul equipment that require programmable logic density and flexible I/O.
  • High‑Speed Networking Line cards, muxponders and transponders for 40G/100G networking where embedded memory and programmable interfaces are needed.
  • Broadcast and Pro AV Studio switches and professional video processing systems that benefit from large on-chip RAM and configurable logic.
  • Computing & Storage Acceleration Server acceleration and flash cache applications leveraging extensive logic, DSP capability and memory for data-path tasks.

Unique Advantages

  • Large programmable capacity: 1,150,000 logic elements enable complex system-on-FPGA implementations and high gate-count designs.
  • Significant embedded memory: 68,857,856 RAM bits provide on-chip storage for buffering, caching and large data structures without external memory dependence.
  • High I/O count: 480 I/O pins support dense peripheral connectivity and multiple high-speed interfaces on a single device.
  • Family-level integration: Arria 10 family features such as DSP blocks, PLLs and hard IP options support mixed signal, timing and protocol needs.
  • Extended-grade operation: Rated 0°C to 100°C to suit a wide range of commercial and industrial-adjacent thermal environments.
  • RoHS compliance: Meets environmental material restrictions for global product programs.

Why Choose 10AX115U4F45E3LG?

The 10AX115U4F45E3LG positions itself as a mid-range Arria 10 GX FPGA offering a balance of large logic capacity, extensive embedded memory and high I/O density in a high‑pin‑count FCBGA package. It is suitable for designers targeting high-performance, power-conscious midrange applications across wireless, wireline, broadcast and compute markets.

With documented device-family capabilities—including DSP blocks, configurable clocking/PLL resources, transceiver support and hard IP options—this device supports scalable designs that require on‑chip integration, reconfigurability and a robust development flow.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time details for the 10AX115U4F45E3LG. Our team can provide component sourcing and order support tailored to your project timeline.

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