10AX115U4F45I3SGE2

IC FPGA 480 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,192 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U4F45I3SGE2 – Arria 10 GX FPGA (1,150,000 logic elements)

The 10AX115U4F45I3SGE2 is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1932-FCBGA (45×45) package. It belongs to the Arria 10 family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-sensitive applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military, this device combines large programmable logic capacity, extensive embedded memory and I/O, and integrated high-speed interface capabilities to support demanding midrange designs.

Key Features

  • Logic Capacity  1,150,000 logic elements for complex, high-density digital designs.
  • Embedded Memory  68,857,856 total RAM bits to support large on-chip data buffering and state storage.
  • I/O Density  480 general-purpose I/Os to connect to external devices, memory, and high-pin-count systems.
  • Package & Mounting  1932‑FBGA (45×45) FCBGA package, surface-mount for compact, high-density systems integration.
  • Industrial Grade Temperature  Operating range −40°C to 100°C suitable for industrial applications.
  • Low-Voltage Core  Core voltage supply between 870 mV and 930 mV for power-efficient operation.
  • High-Speed Interfaces & Hard IP  Includes support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers as described for the Arria 10 family.
  • Clocking and PLLs  Fractional synthesis and multiple PLL clock sources and networks to meet diverse timing and synchronization needs.
  • DSP and Reconfiguration  Variable‑precision DSP blocks and support for dynamic and partial reconfiguration for runtime flexibility (family-level capability).
  • SoC Integration  Arria 10 family devices provide options for a hard processor system (HPS) for tighter software/hardware integration (family-level feature).

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul solutions that require high logic density and embedded memory.
  • Wireline Networking  40G/100G muxponders, transponders and line cards where high-speed serial interfaces and PCIe hard IP are required.
  • Broadcast and Professional AV  Studio switches and transport equipment leveraging large on-chip memory and high I/O counts for signal routing and buffering.
  • Compute & Storage Acceleration  Flash cache, server acceleration and cloud compute modules that benefit from programmable logic, DSP resources, and high I/O density.
  • Medical & Defense Systems  Diagnostic imaging, radar, and electronic warfare subsystems that require high performance, reconfigurability, and an extended operating temperature range.

Unique Advantages

  • High Logic Density: 1,150,000 logic elements enable implementation of complex algorithms and large custom logic blocks on a single device.
  • Substantial On-Chip Memory: Nearly 69 million bits of embedded RAM reduce dependence on external memory and improve data throughput for buffering and lookup operations.
  • Industrial Temperature Range: Rated −40°C to 100°C to support deployment in demanding environmental conditions.
  • Comprehensive High-Speed IP: Family-level PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet/Interlaken PCS support accelerate integration of common high-speed interfaces.
  • Power-Efficient Core Voltage: Core supply from 870 mV to 930 mV supports designs targeting lower power consumption.
  • Compact, High-Density Package: 1932-FCBGA (45×45) surface-mount package provides a high I/O count and routing density for advanced system designs.

Why Choose 10AX115U4F45I3SGE2?

The 10AX115U4F45I3SGE2 positions itself as a midrange, high-capacity FPGA option within the Intel Arria 10 GX family, combining substantial logic and memory resources with industry-oriented temperature and power specifications. It is suited to engineers building performance-sensitive systems that require large programmable logic, significant embedded RAM, and robust I/O and high-speed interface support.

Choosing this device provides scalability for complex designs, on-chip resources that reduce external component requirements, and family-level features—such as DSP blocks, rich clocking, and high-speed serial/hard IP—that streamline integration in communications, compute, broadcast, medical, and defense applications.

If you would like pricing or availability for 10AX115U4F45I3SGE2, request a quote or submit a purchase inquiry today.

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