10AX115U1F45E1SG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,303 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115U1F45E1SG – Arria 10 GX FPGA, 1,150,000 logic element cells

The 10AX115U1F45E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932‑FCBGA (45×45) package. It combines high logic density and substantial on-chip memory with mid-range, power‑aware 20‑nm FPGA architecture suitable for demanding embedded and communications applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and defense, this device targets high‑performance, power‑sensitive designs that require programmable logic, rich I/O, and flexible system integration.

Key Features

  • Core logic density — 1,150,000 logic element cells provide extensive programmable logic capacity for complex custom datapaths and control logic.
  • Embedded memory — 68,857,856 total RAM bits of on‑chip memory for buffering, large lookup tables, and embedded storage close to logic.
  • I/O and interfacing — 480 I/O pins support broad external device connectivity and high‑bandwidth system interfaces.
  • High‑speed serial and protocol support (device family) — Arria 10 device family includes low‑power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3, 10 Gbps Ethernet, and other high‑speed links, enabling direct implementation of common communications standards.
  • DSP and adaptive logic (device family) — Variable‑precision DSP blocks and adaptive logic modules support signal processing, algorithm acceleration, and custom numeric pipelines.
  • Clocking and PLLs (device family) — Advanced clock networks with fractional synthesis and I/O PLLs enable precise clock management and multi‑domain timing architectures.
  • Power and thermal — Supported voltage supply range from 870 mV to 980 mV and an operating temperature range of 0 °C to 100 °C, enabling designs that target extended operating conditions.
  • Package and mounting — Surface‑mount 1932‑FCBGA (45×45) package provides a high pin‑count, solderable footprint for compact system integration.
  • Compliance — RoHS‑compliant construction aligns with common environmental and regulatory requirements.

Typical Applications

  • Wireless infrastructure — Channel and switch cards for remote radio heads and mobile backhaul where programmable logic and embedded memory accelerate baseband and control functions.
  • Wireline networking — 40G/100G muxponders, transponders, and line cards that require protocol hard IP, high I/O counts, and flexible packet processing.
  • Broadcast and professional AV — Studio switches and transport systems that need low‑latency processing, format conversion, and scalable I/O.
  • Computing and storage acceleration — Server acceleration, flash cache, and cloud compute functions that leverage dense logic and on‑chip memory for data path acceleration.
  • Medical and defense systems — Diagnostic imaging, radar, and electronic warfare subsystems that use programmable DSP resources and large memory capacity for signal processing workloads.

Unique Advantages

  • High logic capacity: 1,150,000 logic element cells let you map complex finite state machines, datapaths, and custom accelerators on a single device, reducing board count.
  • Large embedded memory: 68,857,856 RAM bits provide substantial on‑chip buffering and storage to minimize external memory dependencies and lower system latency.
  • Robust I/O flexibility: 480 I/Os enable dense peripheral and high‑speed interconnect routing without immediate need for external multiplexing logic.
  • Power‑aware architecture (device family): Arria 10 family design emphasizes power efficiency and on‑chip power management features, helping designs meet thermal and energy targets.
  • Protocol integration (device family): Hard IP for PCIe and high‑speed Ethernet along with low‑power transceivers reduces design effort for common communications interfaces.
  • Extended operating range: Extended grade and an operating temperature window of 0 °C to 100 °C support deployments in a wide set of environments where commercial‑temperature operation is required.

Why Choose 10AX115U1F45E1SG?

The 10AX115U1F45E1SG delivers a balanced combination of logic density, embedded memory, and I/O capacity in a high‑pin‑count FCBGA package, targeting mid‑range designs that require both performance and power efficiency. Its placement in the Arria 10 family brings device‑level features—such as advanced clocking, DSP resources, and hard protocol IP—that simplify system design for communications, compute acceleration, and high‑throughput signal processing.

For engineering teams building compact, high‑function systems, this device offers scalability and integration that reduce board complexity and support longer product lifecycles with established documentation and ecosystem resources from the Arria 10 device family.

Request a quote or submit a quote today to check availability and receive pricing and lead‑time information for the 10AX115U1F45E1SG.

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