10AX115S4F45I3SG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 576 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S4F45I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 1932-FCBGA (45×45), Industrial

The 10AX115S4F45I3SG is an Intel Arria 10 GX-series FPGA device optimized for midrange, high-performance and power-sensitive designs. It combines a large programmable fabric with embedded memory and transceiver-capable architecture suitable for diverse markets.

Targeted applications include wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and military systems. The device delivers extensive logic, memory and I/O resources while supporting power management and reconfiguration features described in the Arria 10 family documentation.

Key Features

  • Logic Capacity  Approximately 1,150,000 logic elements (logic cells) to implement complex digital designs.
  • Embedded Memory  Total on-chip RAM capacity of 68,857,856 bits for buffering, packet processing, and algorithm acceleration.
  • I/O Resources  Up to 624 I/O pins to support wide external interfacing and multi-channel connectivity.
  • Package & Mounting  1932-ball FCBGA package (45 × 45 mm) in a surface-mount form factor for high-density board integration.
  • Voltage and Power  Core supply operating range of 870 mV to 930 mV, enabling low-voltage system architectures.
  • Operating Temperature  Industrial-grade specification with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Adaptive Logic & DSP  Arria 10 family features such as Adaptive Logic Modules and variable-precision DSP blocks for flexible arithmetic and signal-processing implementations.
  • High-Speed Interfaces  Family-level support for low-power serial transceivers, 10 Gbps Ethernet, Interlaken, and PCIe Gen1/Gen2/Gen3 hard IP, enabling high-bandwidth external links.
  • Clocking & Reconfiguration  Comprehensive clock networks, PLL clock sources, and support for dynamic and partial reconfiguration and power management as described in the Arria 10 device overview.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards, remote radio heads and mobile backhaul equipment leveraging high logic density and transceiver support.
  • Wireline & Optical Networking  40G/100G muxponders, transponders and line cards where embedded memory and high-speed interfaces are required.
  • Broadcast & Professional AV  Studio switches, videoconferencing and professional audio/video systems that need flexible I/O and programmable processing.
  • Computing & Storage Acceleration  Flash cache, server acceleration and cloud computing tasks that benefit from large logic capacity and on-chip RAM.
  • Medical and Defense  Diagnostic imaging, radar and electronic warfare subsystems that require industrial-temperature operation and reconfigurable processing.

Unique Advantages

  • High logic density: 1,150,000 logic elements provide capacity to implement large-scale, complex designs on a single device.
  • Substantial on-chip RAM: 68,857,856 bits of embedded RAM reduce external memory dependence and improve data throughput for packet and streaming applications.
  • Extensive I/O count: 624 I/O pins enable broad peripheral and channel connectivity without extensive external multiplexing.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-demanding installations.
  • Dense, production-ready package: 1932-FCBGA (45×45 mm) surface-mount package supports high-density PCB layouts and robust board-level integration.
  • Family-level system features: Arria 10 capabilities such as PCIe hard IP, low-power transceivers, clocking resources, and dynamic reconfiguration simplify system integration and lifecycle updates.

Why Choose 10AX115S4F45I3SG?

The 10AX115S4F45I3SG positions itself as a high-capacity, industrial-grade FPGA for midrange designs that require a balance of logic density, embedded memory and extensive I/O. Its operating voltage range, thermal rating and 1932-FCBGA packaging make it suitable for demanding embedded and infrastructure applications.

For engineers building wireless, wireline, broadcast, computing/storage, medical or defense systems, this Arria 10 GX device offers the on-chip resources and family-level features—such as advanced DSP blocks, transceiver support, PCIe hard IP, and reconfiguration options—useful for scalable, maintainable designs.

Request a quote or submit an inquiry to receive pricing and availability for the 10AX115S4F45I3SG. Our team can provide lead-time and ordering information to support your design schedule.

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