10AX115S4F45I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 576 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S4F45I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 1932-FCBGA (45×45), Industrial
The 10AX115S4F45I3SG is an Intel Arria 10 GX-series FPGA device optimized for midrange, high-performance and power-sensitive designs. It combines a large programmable fabric with embedded memory and transceiver-capable architecture suitable for diverse markets.
Targeted applications include wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and military systems. The device delivers extensive logic, memory and I/O resources while supporting power management and reconfiguration features described in the Arria 10 family documentation.
Key Features
- Logic Capacity Approximately 1,150,000 logic elements (logic cells) to implement complex digital designs.
- Embedded Memory Total on-chip RAM capacity of 68,857,856 bits for buffering, packet processing, and algorithm acceleration.
- I/O Resources Up to 624 I/O pins to support wide external interfacing and multi-channel connectivity.
- Package & Mounting 1932-ball FCBGA package (45 × 45 mm) in a surface-mount form factor for high-density board integration.
- Voltage and Power Core supply operating range of 870 mV to 930 mV, enabling low-voltage system architectures.
- Operating Temperature Industrial-grade specification with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
- Adaptive Logic & DSP Arria 10 family features such as Adaptive Logic Modules and variable-precision DSP blocks for flexible arithmetic and signal-processing implementations.
- High-Speed Interfaces Family-level support for low-power serial transceivers, 10 Gbps Ethernet, Interlaken, and PCIe Gen1/Gen2/Gen3 hard IP, enabling high-bandwidth external links.
- Clocking & Reconfiguration Comprehensive clock networks, PLL clock sources, and support for dynamic and partial reconfiguration and power management as described in the Arria 10 device overview.
Typical Applications
- Wireless Infrastructure Channel and switch cards, remote radio heads and mobile backhaul equipment leveraging high logic density and transceiver support.
- Wireline & Optical Networking 40G/100G muxponders, transponders and line cards where embedded memory and high-speed interfaces are required.
- Broadcast & Professional AV Studio switches, videoconferencing and professional audio/video systems that need flexible I/O and programmable processing.
- Computing & Storage Acceleration Flash cache, server acceleration and cloud computing tasks that benefit from large logic capacity and on-chip RAM.
- Medical and Defense Diagnostic imaging, radar and electronic warfare subsystems that require industrial-temperature operation and reconfigurable processing.
Unique Advantages
- High logic density: 1,150,000 logic elements provide capacity to implement large-scale, complex designs on a single device.
- Substantial on-chip RAM: 68,857,856 bits of embedded RAM reduce external memory dependence and improve data throughput for packet and streaming applications.
- Extensive I/O count: 624 I/O pins enable broad peripheral and channel connectivity without extensive external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-demanding installations.
- Dense, production-ready package: 1932-FCBGA (45×45 mm) surface-mount package supports high-density PCB layouts and robust board-level integration.
- Family-level system features: Arria 10 capabilities such as PCIe hard IP, low-power transceivers, clocking resources, and dynamic reconfiguration simplify system integration and lifecycle updates.
Why Choose 10AX115S4F45I3SG?
The 10AX115S4F45I3SG positions itself as a high-capacity, industrial-grade FPGA for midrange designs that require a balance of logic density, embedded memory and extensive I/O. Its operating voltage range, thermal rating and 1932-FCBGA packaging make it suitable for demanding embedded and infrastructure applications.
For engineers building wireless, wireline, broadcast, computing/storage, medical or defense systems, this Arria 10 GX device offers the on-chip resources and family-level features—such as advanced DSP blocks, transceiver support, PCIe hard IP, and reconfiguration options—useful for scalable, maintainable designs.
Request a quote or submit an inquiry to receive pricing and availability for the 10AX115S4F45I3SG. Our team can provide lead-time and ordering information to support your design schedule.

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