10AX115S4F45E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 37 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S4F45E3LG – Arria 10 GX FPGA (1932-FCBGA)
The 10AX115S4F45E3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package. It is part of the Arria 10 family of 20‑nm mid-range FPGAs and SoCs designed for performance- and power-sensitive system designs.
Suited for wireless infrastructure, high-speed networking, broadcast/video, compute acceleration and medical systems, the device combines high logic density, large embedded RAM capacity and a rich I/O set to address complex, data‑intensive applications.
Key Features
- Logic Capacity — 1,150,000 logic elements (cells) and 427,200 adaptive logic elements as reported in the product data, enabling large, complex logic implementations.
- On‑chip Memory — 68,857,856 total RAM bits for buffering, packet processing and local storage of intermediate data.
- I/O and Packaging — 624 user I/O in a 1932‑FCBGA package (supplier package: 1932‑FCBGA (45×45)) with surface‑mount mounting for high‑density board designs.
- Power and Voltage — Core voltage supply range from 870 mV to 930 mV for controlled power domains and system integration.
- Operating Range and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
- Family‑Level System Features — Arria 10 family capabilities include Adaptive Logic Modules, variable‑precision DSP blocks, embedded memory block types and fractional/IO PLL clock networks as described in the device overview.
- High‑Speed Interfaces — Family documentation cites PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet support, and low‑power serial transceivers for multi‑Gb/s links.
- Configuration and Reconfiguration — Family features include support for dynamic and partial reconfiguration and advanced configuration options described in the Arria 10 device overview.
Typical Applications
- Wireless Infrastructure — FPGA logic density and embedded RAM support channel processing and backhaul functions in base stations and remote radio heads.
- High‑Speed Networking — Large logic and I/O count combined with family support for PCIe and 10 Gbps Ethernet make the device suitable for line cards, muxponders and network aggregation.
- Broadcast and Video Processing — Extensive on‑chip memory and DSP resources enable video transcoding, routing and professional audio/video processing tasks.
- Compute Acceleration — High logic capacity and embedded memory support server acceleration, flash cache, and cloud computing offload applications.
- Medical Imaging & Diagnostics — On‑device RAM and reconfigurable logic support imaging pipelines and real‑time data processing in diagnostic scanners.
Unique Advantages
- High Logic Density: 1,150,000 logic elements and 427,200 adaptive logic elements enable integration of complex functions that reduce board‑level component count.
- Large On‑Chip Memory: Nearly 69 million RAM bits provide substantial local buffering for high‑throughput data paths and pipeline staging without external memory pressure.
- Extensive I/O in a Compact Package: 624 I/O in a 1932‑FCBGA (45×45) surface‑mount package supports dense system routing and high‑pin‑count interfaces on modern PCBs.
- Family Proven Interfaces: Arria 10 family support for PCIe Gen1/2/3, Interlaken and 10 Gbps Ethernet simplifies implementation of standard high‑speed links.
- Power and Thermal Considerations: Specified core voltage range (870–930 mV) and extended operating temperature (0 °C–100 °C) provide predictable integration parameters for system power and thermal design.
- Reconfiguration Flexibility: Support for dynamic and partial reconfiguration (family feature) enables in‑field updates and design partitioning for maintenance and feature upgrades.
Why Choose 10AX115S4F45E3LG?
The 10AX115S4F45E3LG positions itself as a high‑capacity, mid‑range Arria 10 GX FPGA option for engineers requiring a balance of logic density, embedded memory and robust I/O in a single‑chip solution. Its specifications—large logic and RAM resources, extensive I/O and family‑level support for high‑speed protocols—make it suitable for systems that must handle intensive data movement and real‑time processing while enabling reconfigurable design methodologies.
For teams designing wireless infrastructure, networking equipment, broadcast/video systems, data‑center accelerators or medical devices, this device provides the building blocks needed for scalable, maintainable designs backed by the Arria 10 device family documentation and configuration features.
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