10AX115S3F45I2SGES

The 10AX115S3F45I2SGES is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm mid-range FPGA architecture. It combines high logic capacity, substantial embedded RAM, and a large I/O count to address power-sensitive, high-performance applications across wireless, wireline, broadcast, computing, medical, and military markets.

Designed for systems that require scalable programmable logic, on-chip memory and robust I/O integration, this industrial-grade device delivers a balance of performance and efficiency with support for advanced features documented across the Arria 10 device family.

Key Features

• Core Logic — 1,150,000 logic elements provide extensive programmable resources for complex digital functions and large-scale logic integration.
• Programmable Logic Blocks — 427,200 LAB/CLB equivalents provide a flexible routing and logic fabric for custom architectures and IP integration.
• Embedded Memory — 68,857,856 total RAM bits on-chip to support large buffering, caching, and on-FPGA data structures.
• I/O Density — 624 user I/O pins enable broad external interfacing for high-bandwidth data paths and multi-channel connectivity.
• Package & Mounting — Available in a 1932-BBGA (1932-FCBGA, 45×45) package designed for surface-mount assembly to accommodate high pin counts in compact footprints.
• Power — Core voltage supply range of 870 mV to 930 mV, aligning with low-voltage, power-sensitive system designs.
• Operating Range — Industrial temperature grade with operating range from −40 °C to 100 °C for extended-environment deployments.
• Arria 10 Family Capabilities — Series-level features include support for external memory interfaces, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for high-speed protocols, low-power serial transceivers, dynamic and partial reconfiguration, and comprehensive clocking resources.

Typical Applications

• Wireless Infrastructure — Channel cards and remote radio head functions where high logic density and on-chip memory support signal processing and mobile backhaul tasks.
• Wireline Networking — Line cards, muxponders and transponders for 40G/100G systems that require high I/O count and protocol hard IP.
• Broadcast & Pro AV — Studio switching, transport and videoconferencing equipment that demand flexible I/O and on-FPGA buffering.
• Computing & Storage — Server acceleration, flash cache and cloud infrastructure elements leveraging large embedded memory and reconfigurable logic.
• Medical & Defense Systems — Diagnostic imaging, radar and secure communications applications benefiting from industrial temperature range and extensive logic resources.

Unique Advantages

• High Logic Capacity: 1,150,000 logic elements enable integration of complex custom logic and multiple IP blocks on a single device, reducing system BOM and board-level complexity.
• Substantial On-Chip Memory: Nearly 69 million bits of embedded RAM support large buffering and low-latency data paths without external memory for many functions.
• Large I/O and Dense Packaging: 624 I/O pins in a 1932-FCBGA (45×45) package provide the pin count needed for multi-channel interfaces and high-bandwidth connectivity.
• Power-Aware Design: 870–930 mV supply window and Arria 10 family power-saving technologies help optimize system power for energy-sensitive applications.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in extended-environment and industrial deployments.
• Family-Level Integration: Arria 10 features such as PCIe hard IP, support for high-speed serial protocols, and dynamic reconfiguration help accelerate time to market and enable advanced system architectures.

Why Choose 10AX115S3F45I2SGES?

The 10AX115S3F45I2SGES positions itself as a high-capacity, power-conscious midrange FPGA for applications that require a combination of dense logic, ample on-chip RAM, and broad I/O connectivity. As a member of the Intel Arria 10 family, it inherits device-level capabilities for high-speed interfaces, reconfiguration and system-level power management that help designers scale and evolve their platforms.

This device is suited to engineers and system designers building communications, compute acceleration, imaging, and secure or defense-oriented systems where industrial temperature support, high logic/memory resources and extensive external interfacing are key decision drivers.

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