10AX115S3F45I2LG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,099 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S3F45I2LG – Arria 10 GX FPGA, 1932‑FCBGA

The 10AX115S3F45I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm mid-range FPGA architecture. It targets high-performance, power-sensitive applications across wireless, wireline, broadcast, computing and storage, medical, and military markets.

This device combines high logic density and on-chip memory with configurable transceivers, hard IP for common protocols, and features for dynamic and partial reconfiguration—providing a flexible platform for complex, throughput‑oriented designs.

Key Features

  • Core architecture: 20 nm Arria 10 GX device family optimized for mid-range, performance-sensitive applications as described in the device overview.
  • Logic resources: 1,150,000 logic elements for implementing large, compute‑intensive designs.
  • Embedded memory: 68,857,856 total RAM bits to support large buffers, caches, and on-chip data storage.
  • High I/O count: 624 I/Os to accommodate complex external interfaces and system integration.
  • Transceivers and protocol IP: Low‑power serial transceivers plus documented hard IP including PCIe Gen1/Gen2/Gen3, enhanced PCS for Interlaken and 10 Gbps Ethernet capabilities (per device overview).
  • DSP and processing blocks: Variable‑precision DSP blocks to support a range of signal processing tasks.
  • Clocking and PLLs: Fractional synthesis and I/O PLLs and scalable clock networks for advanced timing and clocking requirements.
  • Configuration and reconfiguration: Support for dynamic and partial reconfiguration and enhanced configuration methods as described in the device overview.
  • Package and mounting: 1932‑FCBGA package (45 × 45 mm) in a surface‑mount format for high‑pin‑count board designs.
  • Power and environmental: Supply range 870 mV to 930 mV; operating temperature −40 °C to 100 °C; RoHS compliant; Grade: Industrial.

Typical Applications

  • Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul applications leveraging high logic density and transceiver capability.
  • Wireline communications: 40G/100G muxponders, transponders, and line cards that require protocol hard IP and high I/O counts.
  • Broadcast and media: Studio switches, transport servers, and videoconferencing systems that benefit from embedded memory and DSP resources.
  • Computing and storage acceleration: Flash cache, server acceleration, and cloud compute offload where large on‑chip memory and reconfigurable logic improve throughput.
  • Medical and defense systems: Diagnostic imaging, radar, guidance, and secure communications leveraging industrial temperature range and high compute capability.

Unique Advantages

  • High logic density: 1,150,000 logic elements provide capacity for large-scale, complex designs without additional FPGAs.
  • Substantial on‑chip memory: Nearly 69 Mb of embedded RAM reduces reliance on external memory for buffering and low-latency data paths.
  • Robust I/O and protocol support: 624 I/Os combined with PCIe Gen1/2/3 hard IP and advanced transceivers simplify integration of high-speed interfaces.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
  • Flexible reconfiguration: Support for dynamic and partial reconfiguration enables in-field updates and resource optimization.
  • Compact, high‑pin package: 1932‑FCBGA (45 × 45 mm) provides a high-pin-count solution in a surface‑mount form factor for dense board designs.

Why Choose 10AX115S3F45I2LG?

The 10AX115S3F45I2LG Arria 10 GX FPGA combines high logic and memory capacity with protocol hard IP and flexible reconfiguration options, making it suitable for mid‑range applications that demand both performance and power efficiency. Its 20 nm architecture and documented device features position it for roles in communications, compute acceleration, media processing, and mission‑critical systems.

With an industrial operating range, a high I/O count, and a high‑pin‑count FCBGA package, this device supports scalable system designs and helps reduce external component count while enabling advanced interface and signal processing capabilities within a single FPGA solution.

Request a quote or submit an inquiry to discuss availability and pricing for 10AX115S3F45I2LG and to evaluate it for your next design.

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