10AX115S2F45I2SGE2

IC FPGA 624 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,040 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S2F45I2SGE2 – Arria 10 GX FPGA, 1,150,000 logic elements, 1932-FCBGA

The 10AX115S2F45I2SGE2 is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1932-FCBGA (45×45) package. It delivers a large programmable fabric—1,150,000 logic elements—with 68,857,856 total RAM bits and 624 general-purpose I/O for complex, high‑throughput designs.

Part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs, this industrial-grade device targets wireless, wireline, broadcast, computing and storage, medical, and defense applications where performance, power efficiency, and system integration are required.

Key Features

  • High-density logic — 1,150,000 logic elements to implement large-scale digital functions, DSP pipelines, and control logic.
  • Large on-chip memory — 68,857,856 total RAM bits for buffering, packet staging, and embedded data structures.
  • Rich I/O — 624 I/O pins for broad external interface support and high connectivity to peripherals and memory devices.
  • Package and mounting — 1932-FCBGA (45×45) surface-mount package designed for dense board integration.
  • Industrial operating range — Rated for −40 °C to 100 °C to meet demanding environmental requirements.
  • Tight core voltage range — Specified supply voltage from 870 mV to 980 mV for the programmable core.
  • Arria 10 series system features — Series-level capabilities include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP (including 10 Gbps Ethernet), and low‑power serial transceivers.
  • System-level capabilities — Series documentation highlights support for external memory interfaces, dynamic and partial reconfiguration, SEU error detection and correction, and power management features.

Typical Applications

  • Wireless infrastructure — Implements channel processing, backhaul and radio-head functions, leveraging high logic count and DSP resources.
  • High-speed networking and wireline — Supports line cards, muxponders and transponders that require large embedded memory and PCIe/10 Gbps-capable IP.
  • Server acceleration and computing — Acts as an FPGA accelerator for flash cache, cloud servers and custom compute offload with extensive logic and RAM.
  • Broadcast and professional media — Enables video switching, transport and real‑time processing using abundant logic and on-chip memory.
  • Industrial and medical systems — Industrial-grade temperature range and high I/O count support robust imaging, diagnostics and control systems.

Unique Advantages

  • Large programmable fabric: 1,150,000 logic elements provide capacity for complex SoC-like implementations without external ASICs.
  • Significant on-chip memory: 68,857,856 RAM bits reduce dependency on external buffering and improve deterministic performance for real‑time tasks.
  • High connectivity: 624 I/O pins and a dense 1932-FCBGA package enable multi‑lane interfaces and compact board layouts.
  • Series-proven IP: Arria 10 family features such as PCIe hard IP, enhanced PCS, and low‑power transceivers accelerate integration of high‑speed protocols.
  • Industrial reliability: Specified −40 °C to 100 °C operating range and surface-mount package support deployment in demanding environments.
  • Power-conscious operation: Narrow core voltage specification (870 mV–980 mV) supports controlled power delivery and system-level power management strategies.

Why Choose 10AX115S2F45I2SGE2?

This Arria 10 GX device combines a high-density programmable fabric, substantial embedded memory, extensive I/O and series-level IP blocks to deliver a balanced solution for mid-range designs that demand performance, integration and thermal tolerance. Its industrial-grade ratings and compact 1932-FCBGA package make it suitable for products that require robust operation across a wide temperature range and dense board integration.

Design teams targeting wireless infrastructure, high-speed networking, server acceleration, professional media processing or industrial/medical systems can leverage the device’s capacity and the Arria 10 family features to reduce system complexity and accelerate time to market.

Request a quote or submit a parts inquiry to obtain pricing and availability for the 10AX115S2F45I2SGE2 and to discuss how this Arria 10 GX FPGA can fit your next design.

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