10AX115S2F45I1SG

The 10AX115S2F45I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1932‑FCBGA (45×45) package. It belongs to the Arria 10 family of 20 nm mid‑range FPGAs optimized for high performance and power efficiency.

With 1,150,000 logic elements, 68,857,856 bits of embedded RAM and 624 I/O, this device targets high‑density, power‑sensitive midrange applications across wireless, wireline, broadcast, computing/storage, medical and defense markets.

Key Features

• Arria 10 GX architecture — Part of the Intel Arria 10 device family offering a 20 nm mid‑range FPGA architecture focused on performance and power efficiency.
• High logic density — 1,150,000 logic elements to implement complex FPGA functions and highly integrated designs.
• Large on‑chip memory — 68,857,856 total RAM bits for on‑chip buffers, FIFOs and embedded memory structures.
• Extensive I/O — 624 general purpose I/O pins to support broad external interfacing and memory connectivity.
• Serial and protocol support (family level) — Arria 10 family documentation highlights PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet support and low‑power serial transceivers.
• Power and supply — Core voltage range 870 mV to 980 mV, suitable for modern low‑voltage power architectures.
• Package and mounting — 1932‑FCBGA (45×45) surface‑mount package for high‑density board integration.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where high density logic and power‑efficient processing are required.
• Wireline networking — 40G/100G muxponders, transponders and 100G line cards including bridging and aggregation functions.
• Broadcast and professional AV — Studio switches, video conferencing and professional audio/video processing that demand high I/O and on‑chip memory.
• Computing and storage — Flash cache, cloud computing servers and server acceleration tasks that benefit from high logic capacity and embedded RAM.
• Medical and defense systems — Diagnostic imaging, radar and secure communications applications requiring industrial temperature operation and high integration.

Unique Advantages

• High integration density: 1,150,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board area.
• Ample on‑chip buffering: 68,857,856 RAM bits enable large on‑chip data structures and reduce dependence on external memory for many designs.
• Broad external interfacing: 624 I/O pins provide flexibility for complex peripheral and memory interfaces without multiple devices.
• Industrial readiness: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh environments.
• Low‑voltage core operation: 870–980 mV supply range aligns with modern power systems and helps optimize board power design.
• Family‑level protocol support: Arria 10 family features such as PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet enable integration of common high‑speed interfaces (as documented for the device family).

Why Choose 10AX115S2F45I1SG?

The 10AX115S2F45I1SG delivers a compelling mix of logic density, embedded memory and I/O capacity in an industrial‑grade Arria 10 GX package. It is positioned for midrange designs that require high performance while maintaining power efficiency and board integration.

Design teams targeting wireless infrastructure, high‑speed networking, broadcast, server acceleration or industrial systems can leverage this device’s on‑chip resources and Arria 10 family capabilities to simplify architectures and support long‑term product roadmaps, backed by Intel Arria 10 documentation and device resources.

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