10AX115S2F45I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,486 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S2F45I2LG – Arria 10 GX FPGA, 1932-FCBGA (45×45)
The 10AX115S2F45I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1932-FCBGA (45×45) package, optimized for mid-range, high-performance designs. As a member of the Arria 10 device family, it leverages a 20 nm architecture focused on performance and power efficiency.
This device targets applications across wireless, wireline, broadcast, computing and storage, and other markets that require substantial logic density, embedded memory, and extensive I/O connectivity while operating over industrial temperature ranges.
Key Features
- Core Logic 1,150,000 logic elements provide the capacity for large-scale custom logic and complex FPGA implementations.
- Embedded Memory 68,857,856 total RAM bits of on-chip memory for buffering, packet processing, and data storage.
- I/O Density 624 user I/Os to support wide peripheral and interface connectivity.
- Adaptive Architecture Arria 10 family features such as Adaptive Logic Module and variable-precision DSP blocks for flexible compute and signal-processing tasks (series-level capability).
- High-Speed Serial and Protocol IP Family-level features include low-power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3, enhanced PCS for Interlaken and 10 Gbps Ethernet (series-level functionality).
- Package & Mounting 1932-BBGA, FCBGA package (supplier device package: 1932-FCBGA (45×45)); surface-mount mounting type for high-density PCB designs.
- Power Supply Core voltage supply range of 870 mV to 980 mV to match system power-rail requirements.
- Industrial Operating Range Rated for -40 °C to 100 °C operating temperature and RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems that require high logic density and flexible DSP resources.
- Wireline Networking 40G/100G muxponders, transponders, and 100G line cards leveraging on-chip memory, transceivers, and protocol hard IP.
- Broadcast and Media Studio switches, video transport, and professional audio/video processing that benefit from large embedded memory and abundant I/O.
- Computing & Storage Flash cache, server acceleration, and cloud computing applications requiring dense logic and on-chip memory for data handling.
- Defense & Secure Communications Radar, electronic warfare, and secure communications where industrial temperature operation and design flexibility are required.
Unique Advantages
- High logic capacity: 1,150,000 logic elements enable complex, compute-intensive designs without external logic augmentation.
- Large on-chip memory: 68,857,856 RAM bits reduce external memory dependence and improve latency for buffering and packet processing.
- Extensive I/O: 624 I/Os allow broad peripheral and high-speed interface support in a single device.
- Industrial-ready operation: -40 °C to 100 °C rating and RoHS compliance support deployment in demanding environments.
- Compact, high-density package: 1932-FCBGA (45×45) enables high-pin-count integration in space-constrained system designs.
- Family-level performance and efficiency: As part of the Arria 10 family, the device benefits from a 20 nm architecture designed for performance and power efficiency.
Why Choose 10AX115S2F45I2LG?
The 10AX115S2F45I2LG combines substantial logic capacity, large embedded memory, and a wide I/O complement in a compact FCBGA package, making it suitable for mid-range, performance-sensitive FPGA designs. Its industrial temperature rating and RoHS compliance support reliable operation across a broad set of deployment scenarios.
Backed by Arria 10 family documentation and device-level features such as variable-precision DSP blocks and hardened protocol IP, this part is positioned for customers building complex networking, communications, broadcast, compute, and defense systems that require scalable logic and on-chip resources.
Request a quote or submit an inquiry for pricing and availability of the 10AX115S2F45I2LG to move your design to production.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018