10AX115S2F45I2SG

The 10AX115S2F45I2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) manufactured in a 20‑nm process. It delivers a high‑density, mid‑range FPGA fabric targeted at high‑performance, power‑sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

This device integrates a large logic array, substantial on‑chip RAM, abundant I/O and transceiver capabilities in a 1932‑FCBGA (45×45) surface‑mount package, providing designers with programmable bandwidth and memory resources for complex system tasks.

Key Features

• Core Logic — 1,150,000 logic elements for complex programmable logic and large custom compute implementations.
• Embedded Memory — 68,857,856 total RAM bits to support large buffers, caches, and packet/stream processing.
• I/O & Pin Count — 624 I/O pins to connect to high‑pin‑count peripherals and multichannel interfaces.
• High‑Speed Interfaces & Hard IP — Device family documentation includes support for PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet, and low‑power serial transceivers suitable for high‑bandwidth links.
• Configuration & Reliability — Architecture and documentation provide facilities for dynamic and partial reconfiguration, SEU error detection and correction, and power management features.
• Package & Mounting — 1932‑FCBGA (45×45) package in a surface‑mount form factor for high‑density board designs.
• Power Supply — Core voltage supply range: 870 mV to 980 mV.
• Operating Temperature — Industrial grade operation from −40 °C to 100 °C.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s high logic density and transceiver support.
• Wireline Networking — 40G/100G muxponders, transponders and 100G line cards where large on‑chip memory and hard IP for high‑speed serial protocols are required.
• Broadcast & Professional AV — Studio switching, videoconferencing and professional audio/video processing that benefit from abundant logic and I/O resources.
• Compute & Storage Acceleration — Flash cache, cloud server acceleration and other data‑path tasks utilizing the device’s combination of logic, memory, and high‑speed interfaces.

Unique Advantages

• High programmable capacity: 1,150,000 logic elements provide the scale needed for complex algorithms, protocol stacks, and hardware acceleration blocks.
• Large on‑chip RAM: 68,857,856 total RAM bits enable deep buffering and high‑throughput data paths without immediate reliance on external memory.
• Extensive I/O and serial support: 624 I/O pins plus documented support for PCIe and 10 Gbps Ethernet hard IP simplify integration of multi‑lane and high‑speed systems.
• Industrial temperature rating: −40 °C to 100 °C operation for deployment in demanding thermal environments.
• Compact high‑pin package: 1932‑FCBGA (45×45) brings large I/O and routing density into a surface‑mount footprint suitable for dense PCBs.
• Power‑aware architecture: Part of the Arria 10 family engineered with power‑saving technologies to address power‑sensitive mid‑range designs.

Why Choose 10AX115S2F45I2SG?

The 10AX115S2F45I2SG positions itself as a high‑density, mid‑range FPGA that balances logic capacity, embedded memory, I/O richness and industrial temperature capability. It is suited for system designers building bandwidth‑intensive, power‑sensitive applications where on‑chip resources and high‑speed interfaces reduce external component count and system complexity.

Leveraging the Arria 10 device family architecture and documentation, this device supports development workflows for hardware and software integration, dynamic reconfiguration, and reliability features that help accelerate time‑to‑market for demanding embedded and networked systems.

Request a quote or submit a procurement inquiry today to check pricing and availability for the 10AX115S2F45I2SG.