10AX115S1F45I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 54 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S1F45I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements
The 10AX115S1F45I2SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) optimized for midrange, performance-sensitive designs. Built on the Arria 10 device family architecture, this device combines high logic capacity, substantial embedded memory, and advanced I/O capabilities for demanding communications, compute, and imaging applications.
Its value proposition centers on delivering high logic density and system integration while supporting power-efficient operation and industrial-grade temperature tolerance for deployment in diverse market segments.
Key Features
- Core Logic Approximately 1,150,000 logic elements to implement complex programmable logic and custom digital functions.
- Embedded Memory Total on-chip RAM of 68,857,856 bits for large buffering, packet processing, and memory-mapped designs.
- I/O and Connectivity Up to 624 general-purpose I/Os to support wide external interfacing and high-pin-count systems.
- High-Speed Interfaces Arria 10 family features include PCIe Gen1/Gen2/Gen3 hard IP, low-power serial transceivers, and support for 10 Gbps Ethernet use cases.
- DSP and Signal Processing Variable-precision DSP block architecture in the Arria 10 family for flexible, high-throughput arithmetic and signal-processing tasks.
- Package & Mounting 1932-FCBGA (45×45 mm) package, surface-mount; compact form factor for high-density board designs.
- Power Core voltage supply range of 870 mV to 930 mV to support low-voltage operation and power-optimized designs.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for robust field deployment.
- Compliance RoHS-compliant device meeting standard environmental restrictions for electronic components.
Typical Applications
- Wireless infrastructure Channel cards, remote radio head processing, and mobile backhaul where high logic density and transceiver capability accelerate packet and baseband processing.
- Wireline communications Line cards, muxponders, and transponders that demand large on-chip memory and PCIe/10 Gbps interface support for high-throughput packet handling.
- Computing & Storage Server acceleration and flash cache controllers benefitting from large logic resources and embedded RAM for low-latency data paths.
- Broadcast and Pro AV Video transport, switching, and processing systems that use the device’s I/O count and DSP resources for real-time media handling.
- Medical & Industrial Systems Imaging and diagnostic equipment where deterministic operation, industrial temperature range, and high integration are required.
Unique Advantages
- High logic capacity: 1,150,000 logic elements enable implementation of complex systems-on-chip and large-scale custom logic.
- Substantial on‑chip memory: 68,857,856 total RAM bits reduce external memory dependence and improve throughput for buffering and streaming workloads.
- Extensive I/O: 624 I/Os provide flexibility for multi‑lane interfaces, external memory buses, and mixed-signal peripherals.
- Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for demanding field environments.
- Compact, serviceable package: 1932-FCBGA (45×45) surface-mount package balances high pin count with a compact PCB footprint.
- Power-optimized operation: Low core voltage range (870–930 mV) supports power-sensitive system designs.
Why Choose 10AX115S1F45I2SGES?
The 10AX115S1F45I2SGES positions itself as a high-density, industrial-grade Arria 10 GX FPGA suitable for midrange applications requiring significant logic, memory, and I/O integration. Its combination of 1,150,000 logic elements, large embedded RAM, and broad connectivity options makes it suitable for communications, compute acceleration, and imaging systems that prioritize integration and deterministic operation.
Designed as part of the Intel Arria 10 family, this device benefits from the device-series documentation and development resources that support system design, configuration, and power management for long-term product deployment.
Request a quote or submit a sales inquiry for the 10AX115S1F45I2SGES to check availability and pricing for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018