10AX115S1F45I2SGES

IC FPGA 624 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 54 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S1F45I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements

The 10AX115S1F45I2SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) optimized for midrange, performance-sensitive designs. Built on the Arria 10 device family architecture, this device combines high logic capacity, substantial embedded memory, and advanced I/O capabilities for demanding communications, compute, and imaging applications.

Its value proposition centers on delivering high logic density and system integration while supporting power-efficient operation and industrial-grade temperature tolerance for deployment in diverse market segments.

Key Features

  • Core Logic  Approximately 1,150,000 logic elements to implement complex programmable logic and custom digital functions.
  • Embedded Memory  Total on-chip RAM of 68,857,856 bits for large buffering, packet processing, and memory-mapped designs.
  • I/O and Connectivity  Up to 624 general-purpose I/Os to support wide external interfacing and high-pin-count systems.
  • High-Speed Interfaces  Arria 10 family features include PCIe Gen1/Gen2/Gen3 hard IP, low-power serial transceivers, and support for 10 Gbps Ethernet use cases.
  • DSP and Signal Processing  Variable-precision DSP block architecture in the Arria 10 family for flexible, high-throughput arithmetic and signal-processing tasks.
  • Package & Mounting  1932-FCBGA (45×45 mm) package, surface-mount; compact form factor for high-density board designs.
  • Power  Core voltage supply range of 870 mV to 930 mV to support low-voltage operation and power-optimized designs.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for robust field deployment.
  • Compliance  RoHS-compliant device meeting standard environmental restrictions for electronic components.

Typical Applications

  • Wireless infrastructure  Channel cards, remote radio head processing, and mobile backhaul where high logic density and transceiver capability accelerate packet and baseband processing.
  • Wireline communications  Line cards, muxponders, and transponders that demand large on-chip memory and PCIe/10 Gbps interface support for high-throughput packet handling.
  • Computing & Storage  Server acceleration and flash cache controllers benefitting from large logic resources and embedded RAM for low-latency data paths.
  • Broadcast and Pro AV  Video transport, switching, and processing systems that use the device’s I/O count and DSP resources for real-time media handling.
  • Medical & Industrial Systems  Imaging and diagnostic equipment where deterministic operation, industrial temperature range, and high integration are required.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements enable implementation of complex systems-on-chip and large-scale custom logic.
  • Substantial on‑chip memory: 68,857,856 total RAM bits reduce external memory dependence and improve throughput for buffering and streaming workloads.
  • Extensive I/O: 624 I/Os provide flexibility for multi‑lane interfaces, external memory buses, and mixed-signal peripherals.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for demanding field environments.
  • Compact, serviceable package: 1932-FCBGA (45×45) surface-mount package balances high pin count with a compact PCB footprint.
  • Power-optimized operation: Low core voltage range (870–930 mV) supports power-sensitive system designs.

Why Choose 10AX115S1F45I2SGES?

The 10AX115S1F45I2SGES positions itself as a high-density, industrial-grade Arria 10 GX FPGA suitable for midrange applications requiring significant logic, memory, and I/O integration. Its combination of 1,150,000 logic elements, large embedded RAM, and broad connectivity options makes it suitable for communications, compute acceleration, and imaging systems that prioritize integration and deterministic operation.

Designed as part of the Intel Arria 10 family, this device benefits from the device-series documentation and development resources that support system design, configuration, and power management for long-term product deployment.

Request a quote or submit a sales inquiry for the 10AX115S1F45I2SGES to check availability and pricing for your next design.

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