10AX115R4F40I3SGES

The 10AX115R4F40I3SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1517-FCBGA (40×40) package. It combines large on-chip logic and memory resources with a rich I/O set and midrange FPGA architecture suited to high-performance, power-sensitive designs.

Targeted markets and use cases include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense applications where performance, power efficiency and industrial temperature operation are required.

Key Features

• High Logic Density  Approximately 1,150,000 logic elements provide substantial programmable logic capacity for complex designs and system-level integration.
• Large Embedded Memory  About 68,857,856 total RAM bits of on-chip memory to support buffering, lookup tables and dataflow-intensive processing.
• Comprehensive I/O  342 device I/Os enable broad external connectivity for memory interfaces, high-speed links and mixed-signal peripherals.
• Arria 10 GX Architecture  Series-level features include variable-precision DSP blocks, clock networks with PLLs, and low-power serial transceivers for serial communications and protocol implementation.
• Package and Mounting  1517-FCBGA (40×40) package in a surface-mount form factor for dense board integration.
• Power Supply  Operates from a core voltage supply range of 870 mV to 930 mV to support the device’s power domains.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet broad environmental requirements.
• Standards and Reliability  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel processing, remote radio head and mobile backhaul designs leveraging on-chip DSP and memory for real-time signal tasks.
• Wireline Networking  40G/100G line cards, muxponders and transponders where high logic density and serial transceivers are used to implement packet and line-rate functions.
• Broadcast and Video  Studio routing, video processing and transport systems that require large memory resources and flexible I/O mapping.
• Computing and Storage  Server acceleration, flash cache and cloud compute functions benefiting from dense logic and embedded RAM for packet processing and caching.

Unique Advantages

• Substantial On-Chip Capacity: 1,150,000 logic elements and nearly 69 Mb of embedded RAM enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Flexible I/O and Interfaces: 342 I/Os provide the routing capacity and external connectivity needed for high-bandwidth memory interfaces and peripheral integration.
• Architecture-Level DSP and Transceivers: Series-level DSP blocks and low-power serial transceivers let you implement signal processing and serial protocols without external ASICs.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in demanding environments.
• Compact, Surface-Mount Package: 1517-FCBGA (40×40) package balances thermal and routing considerations for dense system designs.
• RoHS Compliance: Meets regulatory requirements for lead-free manufacturing and environmental compliance.

Why Choose 10AX115R4F40I3SGES?

The 10AX115R4F40I3SGES delivers a combination of high programmable logic capacity, large embedded memory and an extensive I/O complement within the Arria 10 GX family architecture. It is positioned for midrange, performance- and power-sensitive applications where integration and on-chip resources reduce external components and accelerate time to market.

Engineers designing communication systems, compute accelerators, broadcast hardware, and industrial imaging equipment will find the device’s balance of resources, industrial temperature rating, and surface-mount package suitable for production systems requiring scalable logic, memory and interface support.

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