10AX115R4F40I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 977 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R4F40I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX115R4F40I3SG is an Intel Arria 10 GX FPGA in a 1517-FCBGA (40×40) package, offered as a surface-mount, industrial-grade device. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs and targets high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.
With a large programmable fabric, substantial embedded RAM, and a wide operating temperature range, this device is designed to integrate complex logic, memory buffering, and dense I/O into a compact package for demanding midrange FPGA designs.
Key Features
- Programmable Logic Capacity — 1,150,000 logic elements to implement large, complex logic functions and system-level integration.
- On-chip Memory — 68,857,856 total RAM bits for buffering, packet processing, and memory-intensive algorithms.
- I/O Density — 342 I/O pins to support wide bus interfaces, memory interfaces, and multi-channel connectivity.
- Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) surface-mount package for compact board-level integration.
- Voltage & Power — Core supply range 870 mV to 930 mV, enabling low-voltage operation aligned with modern power architectures.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for industrial applications and extended-environment deployments.
- Arria 10 Architecture Features — Series-level capabilities such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, and support for high-speed serial/transceiver and protocol hard IP (as described in the Arria 10 device overview).
- Configuration and System Integration — Supports FPGA configuration, partial/dynamic reconfiguration, and system-level power management as part of the Arria 10 family feature set.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio head interfaces, and mobile backhaul systems that require high logic density and on-chip memory.
- Wireline Networking — Line cards, muxponders, and transponders in 40G/100G systems where FPGA-based packet processing and protocol handling are needed.
- Compute & Storage Acceleration — Server acceleration, flash cache controllers, and cloud-compute offload functions that leverage large logic fabric and embedded RAM.
- Broadcast & Media — Studio switches, video processing, and transport systems that benefit from flexible I/O and significant on-chip buffering.
- Medical & Industrial Imaging — Diagnostic imaging and other instrument control applications that require deterministic processing and extended temperature range.
Unique Advantages
- High Logic Integration: 1,150,000 logic elements reduce external glue logic and enable consolidation of multiple functions into a single device.
- Large On-chip Memory: 68,857,856 bits of RAM support deep buffering and complex data-path implementations without heavily relying on external memory.
- Dense I/O: 342 I/Os provide flexibility to interface with multi-lane standards, memory buses, and mixed-signal front ends.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial and harsh environments.
- Compact Surface-mount Package: 1517-FCBGA (40×40) enables space-efficient board designs while retaining high pin count and signal integrity.
- Low-voltage Core: 870–930 mV supply range aligns with modern power-optimized system designs to help reduce overall power consumption.
Why Choose 10AX115R4F40I3SG?
The 10AX115R4F40I3SG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA suitable for midrange systems that demand substantial logic, memory, and I/O integration in a compact package. Its combination of 1,150,000 logic elements, large embedded RAM, and 342 I/Os makes it appropriate for designs that consolidate multiple functions—from protocol handling to data buffering—onto a single device.
Designed within the Arria 10 family, it benefits from the series’ architecture features—DSP blocks, flexible clocking/PLLs, transceiver and protocol hard IP, and configuration options—providing a scalable platform for engineers developing wireless, wireline, compute acceleration, broadcast, and imaging systems that require reliable, long-life deployment and vendor-supported device documentation.
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