10AX115R4F40I3SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 977 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R4F40I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX115R4F40I3SG is an Intel Arria 10 GX FPGA in a 1517-FCBGA (40×40) package, offered as a surface-mount, industrial-grade device. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs and targets high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

With a large programmable fabric, substantial embedded RAM, and a wide operating temperature range, this device is designed to integrate complex logic, memory buffering, and dense I/O into a compact package for demanding midrange FPGA designs.

Key Features

  • Programmable Logic Capacity — 1,150,000 logic elements to implement large, complex logic functions and system-level integration.
  • On-chip Memory — 68,857,856 total RAM bits for buffering, packet processing, and memory-intensive algorithms.
  • I/O Density — 342 I/O pins to support wide bus interfaces, memory interfaces, and multi-channel connectivity.
  • Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) surface-mount package for compact board-level integration.
  • Voltage & Power — Core supply range 870 mV to 930 mV, enabling low-voltage operation aligned with modern power architectures.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation for industrial applications and extended-environment deployments.
  • Arria 10 Architecture Features — Series-level capabilities such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, and support for high-speed serial/transceiver and protocol hard IP (as described in the Arria 10 device overview).
  • Configuration and System Integration — Supports FPGA configuration, partial/dynamic reconfiguration, and system-level power management as part of the Arria 10 family feature set.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head interfaces, and mobile backhaul systems that require high logic density and on-chip memory.
  • Wireline Networking — Line cards, muxponders, and transponders in 40G/100G systems where FPGA-based packet processing and protocol handling are needed.
  • Compute & Storage Acceleration — Server acceleration, flash cache controllers, and cloud-compute offload functions that leverage large logic fabric and embedded RAM.
  • Broadcast & Media — Studio switches, video processing, and transport systems that benefit from flexible I/O and significant on-chip buffering.
  • Medical & Industrial Imaging — Diagnostic imaging and other instrument control applications that require deterministic processing and extended temperature range.

Unique Advantages

  • High Logic Integration: 1,150,000 logic elements reduce external glue logic and enable consolidation of multiple functions into a single device.
  • Large On-chip Memory: 68,857,856 bits of RAM support deep buffering and complex data-path implementations without heavily relying on external memory.
  • Dense I/O: 342 I/Os provide flexibility to interface with multi-lane standards, memory buses, and mixed-signal front ends.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial and harsh environments.
  • Compact Surface-mount Package: 1517-FCBGA (40×40) enables space-efficient board designs while retaining high pin count and signal integrity.
  • Low-voltage Core: 870–930 mV supply range aligns with modern power-optimized system designs to help reduce overall power consumption.

Why Choose 10AX115R4F40I3SG?

The 10AX115R4F40I3SG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA suitable for midrange systems that demand substantial logic, memory, and I/O integration in a compact package. Its combination of 1,150,000 logic elements, large embedded RAM, and 342 I/Os makes it appropriate for designs that consolidate multiple functions—from protocol handling to data buffering—onto a single device.

Designed within the Arria 10 family, it benefits from the series’ architecture features—DSP blocks, flexible clocking/PLLs, transceiver and protocol hard IP, and configuration options—providing a scalable platform for engineers developing wireless, wireline, compute acceleration, broadcast, and imaging systems that require reliable, long-life deployment and vendor-supported device documentation.

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