10AX115R4F40E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 615 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R4F40E3LG – Arria 10 GX FPGA, 1517-FCBGA (40×40)
The 10AX115R4F40E3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) surface-mount package. It delivers a combination of high logic density and substantial on-chip memory, engineered for mid-range, performance-sensitive applications.
Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and defense applications that benefit from a power-efficient, configurable silicon foundation. Key hardware characteristics include 1,150,000 logic elements, 68,857,856 bits of embedded RAM, and 342 general-purpose I/Os.
Key Features
- Logic Capacity — 1,150,000 logic elements provide large-scale programmable fabric for complex digital designs and system integration.
- On‑Chip Memory — 68,857,856 total RAM bits of embedded memory support buffering, caching, and data-path acceleration without immediate external memory dependence.
- I/O and Packaging — 342 I/O pins in a 1517-BBGA (1517-FCBGA, 40×40) package enable broad connectivity in a compact surface-mount form factor.
- Power Supply — Core voltage specified from 870 mV to 930 mV to match low-voltage FPGA core rails and system power budgets.
- Operating Range and Grade — Extended-grade device rated for 0 °C to 100 °C operating temperature, suitable for many commercial and industrial environments that fall within this range.
- Mounting — Surface-mount FCBGA package for high-density board-level integration.
- Device Family Capabilities — As part of the Arria 10 family, the device is described in the datasheet as a high-performance, power-efficient 20 nm mid-range FPGA family with features such as embedded memory configurations, clock networks, PLLs, and serial transceiver capabilities.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high I/O count accelerate signal processing and interface tasks.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards that require flexible protocol handling and on-chip memory for packet buffering and aggregation.
- Broadcast and Media — Studio switches, video transport, and conferencing equipment leveraging FPGA-based processing for low-latency media routing and format conversion.
- Computing and Storage — Server acceleration, flash cache controllers, and cloud infrastructure modules that use programmable logic for data-path offload and customization.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications applications that use configurable hardware to implement specialized processing pipelines.
Unique Advantages
- High Logic Density: 1,150,000 logic elements allow substantial on-chip integration of complex functions, reducing reliance on external ASICs.
- Large Embedded Memory: Nearly 69 Mbits of RAM enable extensive buffering and local data storage to improve throughput and deterministic behavior.
- Broad I/O Count: 342 I/Os accommodate multiple interfaces and board-level connections, simplifying system I/O routing.
- Compact, Surface‑Mount Package: 1517-FCBGA (40×40) packaging delivers a high-pin-count solution in a space-efficient footprint for dense board designs.
- Low-Voltage Core: Core supply range of 870 mV–930 mV aligns with modern low-power FPGA power domains to help with system power planning.
- Extended Temperature Grade: Rated for 0 °C–100 °C operation to meet a wide set of environmental deployment scenarios within that range.
Why Choose 10AX115R4F40E3LG?
The 10AX115R4F40E3LG positions itself as a high-capacity, energy-conscious Arria 10 GX FPGA for mid-range applications that require significant programmable logic, on-chip memory, and flexible I/O in a compact FCBGA package. Its combination of 1,150,000 logic elements, large embedded RAM, and 342 I/Os supports complex system designs demanding configurable acceleration and interfacing.
For design teams focused on scalability and integration, this device offers a programmable platform aligned with the Arria 10 family’s emphasis on performance and power efficiency, while providing the connectivity and memory resources necessary for diverse embedded, networking, and signal-processing applications.
Request a quote or submit an inquiry for pricing and availability to begin integrating the 10AX115R4F40E3LG into your next design.

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